Patents by Inventor Rongwang Wang

Rongwang Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240153764
    Abstract: In a method for preparing silicon-on-insulator, the first etching stop layer, the second etching stop layer, and the device layer are formed bottom-up on the p-type monocrystalline silicon epitaxial substrate, where the first etching stop layer is made of intrinsic silicon, the second etching stop layer is made of germanium-silicon alloy, and the device layer is made of silicon. After oxidation, bonding, reinforcement, and grinding treatment, selective etching is performed. Through a first selective etching to p+/intrinsic silicon, the thickness deviation of the first etching stop layer on the second etching layer is controlled within 100 nm, and then through the second etching and the third etching, the thickness deviation and the surface roughness of the finally prepared silicon-on-insulator film can be optimized to less than 5 nm and less than 4 ?, respectively, so as to realize the flatness of the silicon-on-insulator film.
    Type: Application
    Filed: April 24, 2023
    Publication date: May 9, 2024
    Applicant: SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY, CHINESE ACADEMY OF SCIENCES
    Inventors: Xing WEI, Ziwen WANG, Rongwang DAI
  • Publication number: 20240096645
    Abstract: A SOI wafer is disclosed. The SOI wafer may be characterized by surface roughness of a top silicon layer of the SOI wafer is less than 4 ?, thickness uniformity of the top silicon layer is within ±1%, and a total number of particles on a surface of the top silicon layer of the SOI wafer, measured with setting of 37 nm of SPx detection threshold, is less than 100.
    Type: Application
    Filed: November 23, 2023
    Publication date: March 21, 2024
    Applicants: Zing Semiconductor Corporation, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences
    Inventors: Xing WEI, Rongwang DAI, Ziwen WANG, Minghao LI, Hongtao XU, Meng CHEN
  • Patent number: 11355279
    Abstract: A sealed core-coil assembly in a submersible transformer includes a coil assembly having an inner coil with inner, outer, upper, and lower surfaces, and an outer coil with inner, outer, upper, and lower surfaces, a core assembly including a core window and core column of a magnetically-permeable material, the core column and core window having inner side surfaces, and an expandable sealing member including an inner cavity that is fillable or evacuatable so that a compliant insulation material is positioned in the inner cavity to block passage of water and prevent the formation of a loop of water, which otherwise would act like an electrical short in a submerged transformer.
    Type: Grant
    Filed: June 7, 2018
    Date of Patent: June 7, 2022
    Assignees: SIEMENS ENERGY GLOBAL GMBH & CO. KG, HAINAN JINPAN SMART TECHNOLOGY CO. LTD
    Inventors: Haoning Liang, Martin Alsina Navarro, Andre Luiz Moreno, Rongwang Wang, Xiong Li
  • Publication number: 20210166865
    Abstract: A sealed core-coil assembly includes a coil assembly having an inner coil with inner, outer, upper, and lower surfaces, and an outer coil with inner, outer, upper, and lower surfaces, a core assembly including a core window and core column of a magnetically-permeable material, the core column and core window having inner side surfaces, and an expandable sealing member including an inner cavity that is fillable or evacuatable. An expandable sealing member is provided between: one or more inner side surfaces of the core column and one or more inner surfaces of the inner coil, the outer surface of the inner coil and the inner surface of the outer coil, and between the upper and lower surfaces of the inner and outer coils and the inner side surfaces of the core window. Core-coil assemblies, sealing assemblies, and sealing methods are provided, as are numerous other aspects.
    Type: Application
    Filed: June 7, 2018
    Publication date: June 3, 2021
    Inventors: Haoning Liang, Martin Alsina Navarro, Andre Luiz Moreno, Rongwang Wang, Xiong Li