Patents by Inventor Rongzhen LIU

Rongzhen LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-field composite-based additive manufacturing device and multi-field composite-based additive manufacturing method
    Patent number: 12145292
    Abstract: The present invention belongs to the technical field related to additive manufacturing, and provides a multi-field composite-based additive manufacturing device and method. The device comprises a powder delivery adjustment module, a sound field control module, a microwave field/thermal field control module and a microprocessor.
    Type: Grant
    Filed: November 26, 2020
    Date of Patent: November 19, 2024
    Assignee: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Yusheng Shi, Rongzhen Liu, Gong Chen, Yu Yang, Jie Liu, Shifeng Wen, Jiamin Wu
  • MULTI-FIELD COMPOSITE-BASED ADDITIVE MANUFACTURING DEVICE AND MULTI-FIELD COMPOSITE-BASED ADDITIVE MANUFACTURING METHOD
    Publication number: 20230027566
    Abstract: The present invention belongs to the technical field related to additive manufacturing, and provides a multi-field composite-based additive manufacturing device and method. The device comprises a powder delivery adjustment module, a sound field control module, a microwave field/thermal field control module and a microprocessor.
    Type: Application
    Filed: November 26, 2020
    Publication date: January 26, 2023
    Applicant: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Yusheng SHI, Rongzhen LIU, Gong CHEN, Yu YANG, Jie LIU, Shifeng WEN, Jiamin WU