Abstract: A process for manufacturing a printed circuit board having high-density microvias formed in a thick substrate is disclosed. The method includes the steps of forming one or more holes in a thick substrate using a laser drilling technique, electroplating the one or more holes with a conductive material, wherein the conductive material does not completely fill the one or more holes, and filling the one or more plated holes with a non-conductive material.

Abstract: A system, method, and computer program product are provided for producing a cavity bottom package of a package-on-package structure. The method includes the steps of receiving a bottom package comprising a substrate material having a top layer including a first set of pads configured to be electrically coupled to a second set of pads of an integrated circuit die. A layer of non-conductive material is applied to the top layer of the bottom package and a cavity is formed in the layer of non-conductive material to expose the first set of pads, where the cavity is configured to contain the integrated circuit die oriented such that the second set of pads face the first set of pads.

Abstract: A system, method, and computer program product are provided for producing a cavity bottom package of a package-on-package structure. The method includes the steps of receiving a bottom package comprising a substrate material having a top layer including a first set of pads configured to be electrically coupled to a second set of pads of an integrated circuit die. A layer of non-conductive material is applied to the top layer of the bottom package and a cavity is formed in the layer of non-conductive material to expose the first set of pads, where the cavity is configured to contain the integrated circuit die oriented such that the second set of pads face the first set of pads.

Abstract: A process for manufacturing a printed circuit board having high-density microvias formed in a thick substrate is disclosed. The method includes the steps of forming one or more holes in a thick substrate using a laser drilling technique, electroplating the one or more holes with a conductive material, wherein the conductive material does not completely fill the one or more holes, and filling the one or more plated holes with a non-conductive material.

Abstract: A BGA funnel adapted for facilitating the loading of BGA packages into a BGA tube includes an rectangularly-shaped housing (16) and a roofing plate (18). The housing member has a loading end (28), an intermediate portion (19), and an unloading end (30). The intermediate portion of the housing member has a central bore (20) of a substantially U-shaped cross-section extending therethrough. The housing member includes a flat bottom portion (22) and a pair of short vertically extending side walls (24, 26) disposed integrally on each side of the bottom portion. An inwardly tapered channel (38) is formed between the side walls and extends between the loading end and the intermediate portion for receiving the BGA package to be inserted into the BGA tube. Narrow step portions (40, 42) are associated with the inwardly tapered channel for supporting only two side edges of the BGA package so that the bottom surface thereof is suspended freely above the top surface of the inwardly tapered channel.