Abstract: A method includes transferring multiple discrete components from a first substrate to a second substrate, including illuminating multiple regions on a top surface of a dynamic release layer, the dynamic release layer adhering the multiple discrete components to the first substrate, each of the irradiated regions being aligned with a corresponding one of the discrete components. The illuminating induces a plastic deformation in each of the irradiated regions of the dynamic release layer. The plastic deformation causes at least some of the discrete components to be concurrently released from the first substrate.

Abstract: A method includes transferring multiple discrete components from a first substrate to a second substrate, including illuminating multiple regions on a top surface of a dynamic release layer, the dynamic release layer adhering the multiple discrete components to the first substrate, each of the irradiated regions being aligned with a corresponding one of the discrete components. The illuminating induces a plastic deformation in each of the irradiated regions of the dynamic release layer. The plastic deformation causes at least some of the discrete components to be concurrently released from the first substrate.

Abstract: A method includes transferring multiple discrete components from a first substrate to a second substrate, including illuminating multiple regions on a top surface of a dynamic release layer, the dynamic release layer adhering the multiple discrete components to the first substrate, each of the irradiated regions being aligned with a corresponding one of the discrete components. The illuminating induces a plastic deformation in each of the irradiated regions of the dynamic release layer. The plastic deformation causes at least some of the discrete components to be concurrently released from the first substrate.

Abstract: A method includes transferring multiple discrete components from a first substrate to a second substrate, including illuminating multiple regions on a top surface of a dynamic release layer, the dynamic release layer adhering the multiple discrete components to the first substrate, each of the irradiated regions being aligned with a corresponding one of the discrete components. The illuminating induces a plastic deformation in each of the irradiated regions of the dynamic release layer. The plastic deformation causes at least some of the discrete components to be concurrently released from the first substrate.

Abstract: A method includes transferring multiple discrete components from a first substrate to a second substrate, including illuminating multiple regions on a top surface of a dynamic release layer, the dynamic release layer adhering the multiple discrete components to the first substrate, each of the irradiated regions being aligned with a corresponding one of the discrete components. The illuminating induces a plastic deformation in each of the irradiated regions of the dynamic release layer. The plastic deformation causes at least some of the discrete components to be concurrently released from the first substrate.

Abstract: A power converter provides power across an isolation barrier, such as through the use of coils. A coil driver has transistors connected in a positive feedback configuration and is coupled to a supply voltage in a controlled manner by measuring the output power and opening or closing a switch as needed between the power supply and the coil driver. An output circuit, such as a FET driver, can be used with or without isolation to provide power and a logic signal.

Abstract: A power converter provides power across an isolation barrier, such as through the use of coils. A coil driver has transistors connected in a positive feedback configuration and is coupled to a supply voltage in a controlled manner by measuring the output power and opening or closing a switch as needed between the power supply and the coil driver. An output circuit, such as a FET driver, can be used with or without isolation to provide power and a logic signal.

Abstract: A power converter provides power across an isolation barrier, such as through the use of coils. A coil driver has transistors connected in a positive feedback configuration and is coupled to a supply voltage in a controlled manner by measuring the output power and opening or closing a switch as needed between the power supply and the coil driver. An output circuit, such as a FET driver, can be used with or without isolation to provide power and a logic signal.

Abstract: A power converter system including an LC oscillator circuit, an oscillator drive circuit for driving the LC oscillator circuit, a rectifier circuit coupled to the LC oscillator circuit for providing a DC output, and a switching circuit for controlling the duty cycle of the oscillator drive circuit to modulate the power in the LC oscillator circuit and the rectifier circuit.

Abstract: A power converter provides power across an isolation barrier, such as through the use of coils. A coil driver has transistors connected in a positive feedback configuration and is coupled to a supply voltage in a controlled manner by measuring the output power and opening or closing a switch as needed between the power supply and the coil driver. An output circuit, such as a FET driver, can be used with or without isolation to provide power and a logic signal.

Abstract: Coil structures and isolators using them. A coil(s) is (are) used as a magnetic field-generating element(s) paired with another coil(s) or other magnetic field-receiving element(s). The coil(s) is(are) formed in or on a substrate which does not include some or all of the driver (i.e., input) or receiver (i.e., output) circuits. The coil(s) and magnetic field-receiving element(s) thus can be manufactured separately from the driver and/or receiver circuitry, using different processes, instead of subjecting the chip areas containing both input and output circuits to post processing to form the coil(s). Isolators can be assembled using such coils with a resultant lower cost. Isolators also can be assembled using transformers made from such coils wherein the transformers can be driven on either of their windings in order to provide bi-directional isolation with a single transformer.

Abstract: A power converter provides power across an isolation barrier, such as through the use of coils. A coil driver has transistors connected in a positive feedback configuration and is coupled to a supply voltage in a controlled manner by measuring the output power and opening or closing a switch as needed between the power supply and the coil driver. An output circuit, such as a FET driver, can be used with or without isolation to provide power and a logic signal.

Abstract: A power converter provides power across an isolation barrier, such as through the use of coils. A coil driver has transistors connected in a positive feedback configuration and is coupled to a supply voltage in a controlled manner by measuring the output power and opening or closing a switch as needed between the power supply and the coil driver. An output circuit, such as a FET driver, can be used with or without isolation to provide power and a logic signal.

Abstract: Coil structures and isolators using them. A coil(s) is (are) used as a magnetic field-generating element(s) paired with another coil(s) or other magnetic field-receiving element(s). The coil(s) is(are) formed in or on a substrate which does not include some or all of the driver (i.e., input) or receiver (i.e., output) circuits. The coil(s) and magnetic field-receiving element(s) thus can be manufactured separately from the driver and/or receiver circuitry, using different processes, instead of subjecting the chip areas containing both input and output circuits to post processing to form the coil(s). Isolators can be assembled using such coils with a resultant lower cost. Isolators also can be assembled using transformers made from such coils wherein the transformers can be driven on either of their windings in order to provide bi-directional isolation with a single transformer.

Abstract: A power converter provides power across an isolation barrier, such as through the use of coils. A coil driver has transistors connected in a positive feedback configuration and is coupled to a supply voltage in a controlled manner by measuring the output power and opening or closing a switch as needed between the power supply and the coil driver. An output circuit, such as a FET driver, can be used with or without isolation to provide power and a logic signal.

Abstract: A power converter provides power across an isolation barrier, such as through the use of coils. A coil driver has transistors connected in a positive feedback configuration and is coupled to a supply voltage in a controlled manner by measuring the output power and opening or closing a switch as needed between the power supply and the coil driver. An output circuit, such as a FET driver, can be used with or without isolation to provide power and a logic signal.

Abstract: A power converter system including an LC oscillator circuit, an oscillator drive circuit for driving the LC oscillator circuit, a rectifier circuit coupled to the LC oscillator circuit for providing a DC output, and a switching circuit for controlling the duty cycle of the oscillator drive circuit to modulate the power in the LC oscillator circuit and the rectifier circuit.

Abstract: A power converter provides power across an isolation barrier, such as through the use of coils. A coil driver has transistors connected in a positive feedback configuration and is coupled to a supply voltage in a controlled manner by measuring the output power and opening or closing a switch as needed between the power supply and the coil driver. An output circuit, such as a FET driver, can be used with or without isolation to provide power and a logic signal.

Abstract: Coil structures and isolators using them. A coil(s) is (are) used as a magnetic field-generating element(s) paired with another coil(s) or other magnetic field-receiving element(s). The coil(s) is(are) formed in or on a substrate which does not include some or all of the driver (i.e., input) or receiver (i.e., output) circuits. The coil(s) and magnetic field-receiving element(s) thus can be manufactured separately from the driver and/or receiver circuitry, using different processes, instead of subjecting the chip areas containing both input and output circuits to post processing to form the coil(s). Isolators can be assembled using such coils with a resultant lower cost. Isolators also can be assembled using transformers made from such coils wherein the transformers can be driven on either of their windings in order to provide bi-directional isolation with a single transformer.