Abstract: A method is provided for applying solder to a flip chip pattern on a circuit board. The method involves forming solder bumps on a chip, and then transferring the solder bumps to the flip chip pattern by soldering the chip to the flip chip pattern, and then gradually heating the solder bumps while applying a force to separate the chip from the circuit board, such that the solder bumps substantially remain adhered to the flip chip pattern. The solder is transferred to the flip chip pattern in order to allow a flexible circuit interconnect to be soldered to the flip chip pattern for the purpose of establishing electronic communications between the circuit board's electronic circuit components and a microprocessor emulator. The electronic circuit can then be evaluated and tested without a microprocessor chip being present on the substrate.

Abstract: An interconnect device and method is provided for establishing communications between an electronic circuit board and a microprocessor emulator, so as to permit the evaluation or testing of an electronic circuit or system without a microprocessor flip chip or an integrated circuit socket being present on the circuit board. The flexible interconnect device serves to electrically connect the emulator to the individual conductors which compose a microprocessor flip chip conductor pattern formed on the electronic circuit board. The method involves a reflow soldering technique which bonds the flexible interconnect device to the microprocessor flip chip conductor pattern on the electronic circuit board, so as to form a reliable electrical connection between the flexible interconnect device and the circuit board.

Abstract: Redundant interconnection bonds are formed on an integrated circuit using an interconnection lead comprising a plurality of electrically conductive fingers separated from each other by an electrically nonconductive medium. The individual conductive fingers are attached to, and extend out from, an electrically conductive base at one end. In addition, the individual conductive fingers are connected to each other at a separate region. The improved interconnect lead is structurally durable and the resulting redundant bond exhibits improved electrical and operating characteristics. The interconnection lead is suitable for use with tape automated bonding or flexible circuitry technologies.