Patents by Inventor RONNIE R. WEI

RONNIE R. WEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CONDITIONALLY ACTIVATED ANTIGEN BINDING POLYPEPTIDE COMPLEXES AND METHODS OF USE THEREOF
    Publication number: 20240059798
    Abstract: Disclosed are antigen binding polypeptide complexes (e.g., antibodies and antigen binding fragments thereof) having certain structural features. Also disclosed are polynucleotides and vectors encoding such polypeptide complexes; cells, pharmaceutical compositions, and kits containing such polypeptide complexes; and methods of using such polypeptide complexes.
    Type: Application
    Filed: December 21, 2022
    Publication date: February 22, 2024
    Inventors: LING XU, LAN WU, EDWARD SEUNG, ZHI-YONG YANG, GARY J. NABEL, ELIAS ZERHOUNI, RONNIE R. WEI, HAO CHEN, MARK GRECI, NICHOLAS JONES
  • ANTIGEN BINDING POLYPEPTIDE COMPLEXES CONTAINING EXTRACELLULAR DOMAINS OF TNFSF LIGANDS
    Publication number: 20240034808
    Abstract: Disclosed are antigen binding polypeptide complexes (e.g., antibodies and antigen binding fragments thereof) having certain structural features. Also disclosed are polynucleotides and vectors encoding such polypeptide complexes; cells, pharmaceutical compositions, and kits containing such polypeptide complexes; and methods of using such polypeptide complexes.
    Type: Application
    Filed: December 16, 2022
    Publication date: February 1, 2024
    Inventors: HEATHER DAWN KAMP, EDWARD SEUNG, ZHI-YONG YANG, GARY J. NABEL, RONNIE R. WEI, ELIAS ZERHOUNI