Abstract: A microelectronic assembly includes a component attached to a substrate by a variable thickness solder joint. The solder joint comprises a first thickness adjacent the central region of the component and a second, relatively greater thickness adjacent the perimeter region of the component. The variable thickness solder joint may be used for attaching a power die to a metal heat sink on a printed circuit board, so that the relatively thin central portion promoted thermal dissipation to maintain the die within a desired operating temperature range, and the relatively thick perimeter region distributes thermally induced stresses to enhance joint strength and reduce fatigue cracking.