Abstract: In a burn-in test configuration wherein a chip board having a plurality of semiconductor chips engages a heat sink board having a plurality of heat sinks. When the boards are operationally engaged, the each semiconductor chip has a heat sink has heat sink spring-loaded against the semiconductor chips. Posts coupled to one board engage posts located on the second board. The engagement of the posts orients and secures the relative positions of the two boards. A clip is provided that secures the relative position of the two boards when the two sets of posts are engaged. To uncouple the two boards, a pressure on the side of the clip permits the two boards to separate.

Abstract: An apparatus for transferring heat during a burn-in procedure comprises a substantially planar base member that includes a plurality of openings extending through the base member, at least one heat sink aligned with each opening, and biasing members connected to the heat sinks for biasing the heat sinks.