Patents by Inventor Ronny EBLING

Ronny EBLING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semi-crystalline copolyamides, moulding compounds comprising same and their use, and mouldings manufactured from same
    Patent number: 12344710
    Abstract: The present invention relates to semi-crystalline copolyamides and to moulding compounds manufactured from same that contain at least one filler, and optionally additives in addition to the semi-crystalline copolyamide. The invention equally relates to mouldings manufactured from same.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: July 1, 2025
    Assignee: EMS-Patent AG
    Inventors: Philipp Harder, Christian Schubert, Ronny Ebling
  • Polyamide moulding compound and its use and mouldings manufactured from the moulding compound
    Patent number: 11453778
    Abstract: The present invention relates to polyamide moulding compounds that contain a semi-crystalline copolyamide, at least one filler, and optionally additives. The invention likewise relates to mouldings manufacture from these moulding compounds and to the use of the moulding compounds to manufacture mouldings.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: September 27, 2022
    Assignee: EMS-Patent AG
    Inventors: Philipp Harder, Christian Schubert, Ronny Ebling
  • Polyamide moulding compounds with low relative permittivity
    Patent number: 10927254
    Abstract: Disclosed are polyamide moulding compounds having a relative permittivity of no more than 3.5 at 2.45 GHz, and having the following components: (A) 25 to 80% by weight of a mixture made of at least one partially crystalline aliphatic polyamide and at least one amorphous or microcrystalline polyamide, (B) 20 to 65% by weight of at least one glass filler, and (C) 0 to 10% by weight of additives, the sum of components (A), (B) and (C) producing 100% by weight. The polyamide moulding compounds are for use in components of devices such as laptops and mobile phones.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: February 23, 2021
    Assignee: EMS-Patent AG
    Inventors: Georg Stöppelmann, Philipp Harder, Etienne Aepli, Ronny Ebling
  • POLYAMIDE MOULDING COMPOUND AND ITS USE AND MOULDINGS MANUFACTURED FROM THE MOULDING COMPOUND
    Publication number: 20210040317
    Abstract: The present invention relates to polyamide moulding compounds that contain a semi-crystalline copolyamide, at least one filler, and optionally additives. The invention likewise relates to mouldings manufacture from these moulding compounds and to the use of the moulding compounds to manufacture mouldings.
    Type: Application
    Filed: August 7, 2020
    Publication date: February 11, 2021
    Applicant: EMS-PATENT AG
    Inventors: Philipp HARDER, Christian SCHUBERT, Ronny EBLING
  • SEMI-CRYSTALLINE COPOLYAMIDES, MOULDING COMPOUNDS COMPRISING SAME AND THEIR USE, AND MOULDINGS MANUFACTURED FROM SAME
    Publication number: 20210040264
    Abstract: The present invention relates to semi-crystalline copolyamides and to moulding compounds manufactured from same that contain at least one filler, and optionally additives in addition to the semi-crystalline copolyamide. The invention equally relates to mouldings manufactured from same.
    Type: Application
    Filed: August 7, 2020
    Publication date: February 11, 2021
    Applicant: EMS-PATENT AG
    Inventors: Philipp HARDER, Christian SCHUBERT, Ronny EBLING
  • Polyamide moulding compounds with low relative permittivity
    Patent number: 10875999
    Abstract: Disclosed are polyamide moulding compounds having a relative permittivity of no more than 3.5 at 2.45 GHz, and having the following components: (A) 25 to 80% by weight of a mixture made of at least one partially crystalline aliphatic polyamide and at least one amorphous or microcrystalline polyamide, (B) 20 to 65% by weight of at least one glass filler, and (C) 0 to 10% by weight of additives, the sum of components (A), (B) and (C) producing 100% by weight. The polyamide moulding compounds are for use in components of devices such as laptops and mobile phones.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: December 29, 2020
    Assignee: EMS-Patent AG
    Inventors: Georg Stöppelmann, Philipp Harder, Etienne Aepli, Ronny Ebling
  • POLYAMIDE MOULDING COMPOUNDS WITH LOW RELATIVE PERMITTIVITY
    Publication number: 20180155545
    Abstract: Disclosed are polyamide moulding compounds having a relative permittivity of no more than 3.5 at 2.45 GHz, and having the following components: (A) 25 to 80% by weight of a mixture made of at least one partially crystalline aliphatic polyamide and at least one amorphous or microcrystalline polyamide, (B) 20 to 65% by weight of at least one glass filler, and (C) 0 to 10% by weight of additives, the sum of components (A), (B) and (C) producing 100% by weight. The polyamide moulding compounds are for use in components of devices such as laptops and mobile phones.
    Type: Application
    Filed: November 29, 2017
    Publication date: June 7, 2018
    Applicant: EMS-PATENT AG
    Inventors: Georg STÖPPELMANN, Philipp HARDER, Etienne AEPLI, Ronny EBLING