Abstract: An optical device may include an outer box. The optical device may include an inner box within the outer box. The optical device may include a heating element on a surface of the inner box. The heating element may include one or more openings. The optical device may include one or more mounting pads. A mounting pad of the one or more mounting pads may be arranged in an opening of the one or more openings and mechanically couple the inner box to the outer box through the opening.

Abstract: An opto-mechanical package may include a package body having a first opening. The opto-mechanical package may include a coupler in the first opening of the package body. The coupler may have a second opening. The coupler may comprise a flexible element. A coefficient of thermal expansion (CTE) of a material of the coupler may be less than a CTE of a material of the package body. The opto-mechanical package may include a window in the second opening of the coupler. A CTE of a material of the window may be less than the CTE of the material of the coupler. The opto-mechanical package may include a first epoxy joint between a surface of the package body and a surface of the coupler. The opto-mechanical package may include a second epoxy joint between a surface of the coupler and a surface of the window.

Abstract: A heatsink may include a base and a plurality of fins, configured to be disposed in an air flow, that extend orthogonally from the base. The plurality of fins may have at least one of a height, an inter-fin spacing, or a thickness that varies in a direction of the air flow.

Abstract: An optical device may include an enclosure including an optical aperture and a plurality of optical components positioned within the enclosure, where the plurality of optical components are to emit and/or receive light through the optical aperture. The optical device may include at least one heating element or cooling element to provide an isothermal environment to the plurality of optical components, where the at least one heating element or cooling element is thermally coupled with the enclosure.

Abstract: An opto-mechanical assembly includes a first thermal control element disposed on a region of a first section of an enclosure; a second thermal control element disposed on a region of a second section of the enclosure; and an optical element that includes a first portion and a second portion. The first thermal control element is configured to heat the first portion of the optical element and to cause the first portion of the optical element to be associated with a first temperature, and the second thermal control element is configured to heat the second portion of the optical element and to cause the second portion of the optical element to be associated with a second temperature. This causes a difference between the first temperature and the second temperature to satisfy a temperature difference threshold. Accordingly, this also causes a temperature gradient along an axis of the optical element to satisfy a temperature gradient threshold.

Abstract: A pluggable optical module may include a substrate. The pluggable optical module may include a compressible sliding thermal interface disposed on the substrate to contact a riding heatsink. The compressible sliding thermal interface material may be compressed to fill interstices between a first surface of the substrate and a second surface of the riding heatsink. The compressible sliding thermal interface may protrude from the first surface of the substrate such that insertion of the pluggable optical module into a cage compresses the compressible sliding thermal interface to achieve a threshold thermal boundary resistance.

Abstract: A pluggable optical module may include a substrate. The pluggable optical module may include a compressible sliding thermal interface disposed on the substrate to contact a riding heatsink. The compressible sliding thermal interface material may be compressed to fill interstices between a first surface of the substrate and a second surface of the riding heatsink. The compressible sliding thermal interface may protrude from the first surface of the substrate such that insertion of the pluggable optical module into a cage compresses the compressible sliding thermal interface to achieve a threshold thermal boundary resistance.

Abstract: An opto-mechanical assembly includes a first thermal control element disposed on a region of a first section of an enclosure; a second thermal control element disposed on a region of a second section of the enclosure; and an optical element that includes a first portion and a second portion. The first thermal control element is configured to heat the first portion of the optical element and to cause the first portion of the optical element to be associated with a first temperature, and the second thermal control element is configured to heat the second portion of the optical element and to cause the second portion of the optical element to be associated with a second temperature. This causes a difference between the first temperature and the second temperature to satisfy a temperature difference threshold. Accordingly, this also causes a temperature gradient along an axis of the optical element to satisfy a temperature gradient threshold.

Abstract: An optical bench may include an integrated heater. The integrated heater may include a substrate and a heating element disposed onto the substrate. The heating element may include at least one electrical trace. The integrated heater may be associated with a non-monolithic shape configured to cause the heating element to heat an optical device disposed in proximity to the optical bench with a temperature gradient of less than a threshold. The integrated heater may be disposed onto at least one of a surface of the optical bench or a surface of an optical component of the optical device.

Abstract: A pluggable optical module may include a substrate. The pluggable optical module may include a compressible sliding thermal interface disposed on the substrate to contact a riding heatsink. The compressible sliding thermal interface material may be compressed to fill interstices between a first surface of the substrate and a second surface of the riding heatsink. The compressible sliding thermal interface may protrude from the first surface of the substrate such that insertion of the pluggable optical module into a cage compresses the compressible sliding thermal interface to achieve a threshold thermal boundary resistance.

Abstract: A heatsink may include a base and a plurality of fins, configured to be disposed in an air flow, that extend orthogonally from the base. The plurality of fins may have at least one of a height, an inter-fin spacing, or a thickness that varies in a direction of the air flow.

Abstract: An optical device may include an enclosure including an optical aperture and a plurality of optical components positioned within the enclosure, where the plurality of optical components are to emit and/or receive light through the optical aperture. The optical device may include at least one heating element or cooling element to provide an isothermal environment to the plurality of optical components, where the at least one heating element or cooling element is thermally coupled with the enclosure.

Abstract: A method may include identifying, by a device, a set of components of an optical device. The method may include determining, by the device, a set of design criteria based on the set of components of the optical device. The method may include identifying, by the device, an initial heater configuration based on the set of design criteria. The method may include determining, by the device, a set of optimization parameters for determining a target heater configuration based on the set of design criteria. The method may include performing, by the device and based on the set of optimization parameters, an optimization procedure to alter the initial heater configuration to determine the target heater configuration. The method may include providing, by the device, information identifying the target heater configuration based on performing the optimization procedure.

Abstract: A liquid crystal on substrate (LCOS) assembly may include an LCOS carrier. The LCOS assembly may include at least one thick layer on the LCOS carrier and associated with a threshold thickness. The threshold thickness may be at least 5 micrometers. The LCOS assembly may include a switching engine on the at least one thick layer. The switching engine may include an LCOS die and an LCOS cover glass to enclose an LCOS liquid. The LCOS assembly may be associated with a thermal sensitivity of less than 0.5 millidegrees of curvature per degree Celsius for a particular temperature range.

Abstract: A pluggable optical module may include a substrate. The pluggable optical module may include a compressible sliding thermal interface disposed on the substrate to contact a riding heatsink. The compressible sliding thermal interface material may be compressed to fill interstices between a first surface of the substrate and a second surface of the riding heatsink. The compressible sliding thermal interface may protrude from the first surface of the substrate such that insertion of the pluggable optical module into a cage compresses the compressible sliding thermal interface to achieve a threshold thermal boundary resistance.

Abstract: An optical bench may include an integrated heater. The integrated heater may include a substrate and a heating element disposed onto the substrate. The heating element may include at least one electrical trace. The integrated heater may be associated with a non-monolithic shape configured to cause the heating element to heat an optical device disposed in proximity to the optical bench with a temperature gradient of less than a threshold. The integrated heater may be disposed onto at least one of a surface of the optical bench or a surface of an optical component of the optical device.

Abstract: A method may include identifying, by a device, a set of components of an optical device. The method may include determining, by the device, a set of design criteria based on the set of components of the optical device. The method may include identifying, by the device, an initial heater configuration based on the set of design criteria. The method may include determining, by the device, a set of optimization parameters for determining a target heater configuration based on the set of design criteria. The method may include performing, by the device and based on the set of optimization parameters, an optimization procedure to alter the initial heater configuration to determine the target heater configuration. The method may include providing, by the device, information identifying the target heater configuration based on performing the optimization procedure.

Abstract: A liquid crystal on substrate (LCOS) assembly may include an LCOS carrier. The LCOS assembly may include at least one thick layer on the LCOS carrier and associated with a threshold thickness. The threshold thickness may be at least 5 micrometers. The LCOS assembly may include a switching engine on the at least one thick layer. The switching engine may include an LCOS die and an LCOS cover glass to enclose an LCOS liquid. The LCOS assembly may be associated with a thermal sensitivity of less than 0.5 millidegrees of curvature per degree Celsius for a particular temperature range.

Abstract: A sensing element for sensing a mechanical property of a sample defining a sample surface using a contact force exerted the sample surface. The sensing element includes: a deformable element defining a contact surface and a deformable section in register with the contact surface, the deformable section being deformable between an undeformed configuration and a deformed configuration; a deformation sensor operatively coupled to the deformable section for sensing and quantifying a deformation of the deformable section between the deformed and undeformed configurations, the deformation sensor being an optical deformation sensor; and a force sensor operatively coupled to the deformable element for sensing the contact force exerted on the contact surface.

Abstract: A sensing element for sensing a mechanical property of a sample defining a sample surface using a contact force exerted the sample surface. The sensing element includes: a deformable element defining a contact surface and a deformable section in register with the contact surface, the deformable section being deformable between an undeformed configuration and a deformed configuration; a deformation sensor operatively coupled to the deformable section for sensing and quantifying a deformation of the deformable section between the deformed and undeformed configurations, the deformation sensor being an optical deformation sensor; and a force sensor operatively coupled to the deformable element for sensing the contact force exerted on the contact surface.