Patents by Inventor Rosa Leal

Rosa Leal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interlaced microchannel heat exchanger systems and methods thereto
    Patent number: 12173936
    Abstract: The disclosed technology includes an air system including a first interlaced microchannel heat exchanger and a second interlaced microchannel heat exchanger. The air system can include a plurality of fluidly separated refrigerant circuits, and each of the refrigerant circuits can be configured to flow through the first interlaced microchannel heat exchanger and the second interlaced microchannel heat exchanger. The first interlaced microchannel heat exchanger can be located indoors, and the second interlaced microchannel heat exchanger can be located outdoors. Each of the refrigerant circuits can include its own compressor and expansion valve.
    Type: Grant
    Filed: October 23, 2023
    Date of Patent: December 24, 2024
    Assignee: Rheem Manufacturing Company
    Inventors: Hari Krishna Kanagala, Harold Gene Havard, Jr., Robert Leonard Long, Rosa Leal, David Kauppila, Junjie Luo
  • INTERLACED MICROCHANNEL HEAT EXCHANGER SYSTEMS AND METHODS THERETO
    Publication number: 20240053068
    Abstract: The disclosed technology includes an air system including a first interlaced microchannel heat exchanger and a second interlaced microchannel heat exchanger. The air system can include a plurality of fluidly separated refrigerant circuits, and each of the refrigerant circuits can be configured to flow through the first interlaced microchannel heat exchanger and the second interlaced microchannel heat exchanger. The first interlaced microchannel heat exchanger can be located indoors, and the second interlaced microchannel heat exchanger can be located outdoors. Each of the refrigerant circuits can include its own compressor and expansion valve.
    Type: Application
    Filed: October 23, 2023
    Publication date: February 15, 2024
    Inventors: Hari Krishna Kanagala, Harold Gene Havard, JR., Robert Leonard Long, Rosa Leal, David Kauppila, Junjie Luo
  • Interlaced microchannel heat exchanger systems and methods thereto
    Patent number: 11828499
    Abstract: The disclosed technology includes an air system including a first interlaced microchannel heat exchanger and a second interlaced microchannel heat exchanger. The air system can include a plurality of fluidly separated refrigerant circuits, and each of the refrigerant circuits can be configured to flow through the first interlaced microchannel heat exchanger and the second interlaced microchannel heat exchanger. The first interlaced microchannel heat exchanger can be located indoors, and the second interlaced microchannel heat exchanger can be located outdoors. Each of the refrigerant circuits can include its own compressor and expansion valve.
    Type: Grant
    Filed: January 11, 2022
    Date of Patent: November 28, 2023
    Assignee: Rheem Manufacturing Company
    Inventors: Hari Krishna Kanagala, Harold Gene Havard, Jr., Robert Leonard Long, Rosa Leal, David Kauppila, Junjie Luo
  • INTERLACED MICROCHANNEL HEAT EXCHANGER SYSTEMS AND METHODS THERETO
    Publication number: 20220221203
    Abstract: The disclosed technology includes an air system including a first interlaced microchannel heat exchanger and a second interlaced microchannel heat exchanger. The air system can include a plurality of fluidly separated refrigerant circuits, and each of the refrigerant circuits can be configured to flow through the first interlaced microchannel heat exchanger and the second interlaced microchannel heat exchanger. The first interlaced microchannel heat exchanger can be located indoors, and the second interlaced microchannel heat exchanger can be located outdoors. Each of the refrigerant circuits can include its own compressor and expansion valve.
    Type: Application
    Filed: January 11, 2022
    Publication date: July 14, 2022
    Inventors: Hari Krishna Kanagala, H. Gene Havard, Robert L. Long, Rosa Leal, David Kauppila, Junjie Luo