Abstract: A method of manufacturing a metal component includes performing a test stamping process on a test sheet metal blank, generating a strain map of the test sheet metal blank for the test stamping process, generating a lubrication program based on the strain map, applying lubrication to the sheet metal according to the lubrication program, and stamping the sheet metal to form the metal component. The lubrication program is configured to control a lubrication system to apply lubrication to sheet metal in a non-uniform distribution across the sheet metal. The non-uniform distribution correlates to the strain map.

Abstract: A system and method of verifying that a part is heat treated to strengthen the part. The part is marked with a thermo-chromatic composition before heat treating. The part is then heat treated to strengthen the part and change the color of the thermo-chromatic composition to indicate successful completion of the heat treating process. A detector may act to prevent the inclusion of a non-heat treated part in an assembly by disabling an assembly tool. A controller may also provide data related to the completion of the heat treating process to be recorded in a database.

Abstract: A manufacturing control system is arranged to cause an aluminum alloy blank to be heated to at least its solvus temperature, to cause a die set to be sprayed with a lubricant formulation that includes water, lubricant, and a surfactant, to cause the blank to be positioned in the die set while heated such that the blank does not touch the die set, and to cause the die set to close on the blank to form the blank into a part while quenching the part.

Abstract: A system and method of verifying that a part is heat treated to strengthen the part. The part is marked with a thermo-chromatic composition before heat treating. The part is then heat treated to strengthen the part and change the color of the thermo-chromatic composition to indicate successful completion of the heat treating process. A detector may act to prevent the inclusion of a non-heat treated part in an assembly by disabling an assembly tool. A controller may also provide data related to the completion of the heat treating process to be recorded in a database.

Abstract: A system and method of verifying that a part is heat treated to strengthen the part. The part is marked with a thermo-chromatic composition before heat treating. The part is then heat treated to strengthen the part and change the color of the thermo-chromatic composition to indicate successful completion of the heat treating process. A detector may act to prevent the inclusion of a non-heat treated part in an assembly by disabling an assembly tool. A controller may also provide data related to the completion of the heat treating process to be recorded in a database.

Abstract: A system and method of verifying that a part is heat treated to strengthen the part. The part is marked with a thermo-chromatic composition before heat treating. The part is then heat treated to strengthen the part and change the color of the thermo-chromatic composition to indicate successful completion of the heat treating process. A detector may act to prevent the inclusion of a non-heat treated part in an assembly by disabling an assembly tool. A controller may also provide data related to the completion of the heat treating process to be recorded in a database.

Abstract: A system and a method of processing an F-temper aluminum alloy. An F-temper aluminum alloy blank may be heated and positioned in the die set such that the blank does not touch the die set. The blank may be formed into a part and quenched when the die set is closed.

Abstract: A system and a method of processing an F-temper aluminum alloy. An F-temper aluminum alloy blank may be heated and positioned in the die set such that the blank does not touch the die set. The blank may be formed into a part and quenched when the die set is closed.

Abstract: The present invention consists of an electrical communications device including a three-dimensional substrate and a plurality of electrical devices attached thereto. The substrate is preferably a dielectric. The electrical device is preferably of the sort needed to conduct high frequency communications, such as a microwave antenna and photonic receivers and transmitters. The electrical devices are attached to the substrate at the connection points described by the intersection of a series vias and one of the substrate surfaces. The electrical devices are attached to the substrate in numerous ways, including solder, flipped chip ball bonds, wire bonds, or a gold stud assembly. In particular, the gold stud assembly is utilized to attach the antenna to the substrate, thereby providing a predetermined air gap therebetween.

Abstract: The present invention consists of an electrical communications device including a three-dimensional substrate and a plurality of electrical devices attached thereto. The substrate is preferably a dielectric. The electrical device is preferably of the sort needed to conduct high frequency communications, such as a microwave antenna and photonic receivers and transmitters. The electrical devices are attached to the substrate at the connection points described by the intersection of a series vias and one of the substrate surfaces. The electrical devices are attached to the substrate in numerous ways, including solder, flipped chip ball bonds, wire bonds, or a gold stud assembly. In particular, the gold stud assembly is utilized to attach the antenna to the substrate, thereby providing a predetermined air gap therebetween.

Abstract: A solderless method for assembling a semiconductor electronic flip-chip device to an electrical interconnecting substrate including the steps of forming a plurality of raised electrical contacts and plurality of contact pads. The pads correspond in number and physical location with the electrical contacts. The pads and contact mate when brought together. A quantity of plastic material is interposed between the electrical device and substrate. The plastic material is heated so that it softens and flows. The electronic device and substrate are urged together. The urging step displaces the molten plastic material from between the contacts and pads. The contacts and pads are jointed directly without any adhesive, solder or conducive filler therebetween to electrically interconnect the electronic device and substrate. The plastic material is allowed to cool whereby the electronic device and substrate are adhesively bonded together and electrically interconnected.

Abstract: A method for bonding together at least two conductive members 20, wherein each member includes at least one metallic 22 having a respective bonding area 24. At least one member has a deposition of metallic bonding material 26 attached to each respective conductor proximate each bonding area, and at least one member has a plastic element 28 attached thereto proximate each respective bonding area. The members 20 are positioned in a predetermined orientation, clamped together between an ultrasonic horn and anvil arrangement, with pressure and orthogonal ultrasonic energy being applied thereto so that each plastic element 28 is heated, which in turn melts the bonding material 26. Any plastic element material between the conductors is squeezed away therefrom and the respective conductors 22 are brought into proximity with each other so that a molten joint of bonding material physically contacts each respective conductor.