Abstract: The invention relates to the use of a hybrid material comprising a) an organopolysilazane material and b) at least one surface-modified nanoscale inorganic oxide as coating material for producing transparent layers having a thickness of less than 500 ?m in optoelectronic components.

Abstract: A hybrid material for light emitting diodes, comprising a) an organopolysilazane material, comprising repeating units of formulae (I) and (II) [—SiR1R2—NR3—]x??(I) [—SiHR4—NR5—]y??(II) wherein the symbols and indices have the following meanings: R1 is C2-C6-alkenyl or C4-C6-alkadienyl; R2 is H or an organic group; R3 is H or an organic group; R4 is H or an organic group; R5 is H or an organic group; x is 0.001 to 0.2; and y is 2x to (1?x), with the proviso that x+y?1 and that y can be 0 if R2 is H, and b) inorganic nanoparticles having a mean diameter in the range of from 1 to 30 nm, which are surface modified with a capping agent comprising a C1-C18-alkyl and/or C1-C18-alkenyl group, is useful as encapsulation material for LEDs.

Abstract: The invention relates to the use of specific organopolysilazanes as an encapsulation material for light emitting diodes (LED). The organopolysilazane polymers act as insulating filling materials and are stable over temperature and over exposure to ambient UV radiation. The encapsulating material has good thermal stability against discoloration to yellow by aging even at high temperatures which is a key factor for the long lifetime of an LED encapsulant and the LED performance.

Abstract: The invention relates to the use of a hybrid material comprising a) an organopolysilazane material and b) at least one surface-modified nanoscale inorganic oxide as coating material for producing transparent layers having a thickness of less than 500 ?m in optoelectronic components.

Abstract: A hybrid material for light emitting diodes, comprising a) an organopolysilazane material, comprising repeating units of formulae (I) and (II) [—SiR1R2—NR3—]x??(I) [—SiHR4—NR5—]y??(II) wherein the symbols and indices have the following meanings: R1 is C2-C6-alkenyl or C4-C6-alkadienyl; R2 is H or an organic group; R3 is H or an organic group; R4 is H or an organic group; R5 is H or an organic group; x is 0.001 to 0.2; and y is 2x to (1?x), with the proviso that x+y?1 and that y can be 0 if R2 is H, and b) inorganic nanoparticles having a mean diameter in the range of from 1 to 30 nm, which are surface modified with a capping agent comprising a C1-C18-alkyl and/or C1-C18-alkenyl group, is useful as encapsulation material for LEDs.

Abstract: The invention relates to the use of specific organopolysilazanes as an encapsulation material for light emitting diodes (LED). The organopolysilazane polymers act as insulating filling materials and are stable over temperature and over exposure to ambient UV radiation. The encapsulating material has good thermal stability against discoloration to yellow by aging even at high temperatures which is a key factor for the long lifetime of an LED encapsulant and the LED performance.