Abstract: A 3D wafer-integration uncooled infrared (IR) microbolometer focal plane array (FPA) sensor includes a first die with an FPA of uncooled IR microbolometers, a second die signal-processing layer. The dies are vertically aligned, stacked with 3D wafer bonding, and interconnected. Interconnection include vertical electrical interconnects. Separate optimized manufacturing processes are used for die, so that additional processing costs of the FPA die are leveraged and 3D integration is completed at wafer level, minimizing total device cost and maximizing die count per wafer.

Abstract: A 3D wafer-integration uncooled infrared (IR) microbolometer focal plane array (FPA) sensor includes a first die with an FPA of uncooled IR microbolometers, a second die signal-processing layer. The dies are vertically aligned, stacked with 3D wafer bonding, and interconnected. Interconnection include vertical electrical interconnects. Separate optimized manufacturing processes are used for die, so that additional processing costs of the FPA die are leveraged and 3D integration is completed at wafer level, minimizing total device cost and maximizing die count per wafer.

Abstract: An imaging system configured with readout circuit redundancy is disclosed. Pixel data from a particular column can be steered around a defective readout circuit to an operational readout circuit. Thus, larger imaging arrays which are generally more prone to common column circuitry defects are enabled. In addition, imaging systems configured with significant on-chip signal processing, which are also more prone to common column circuitry defects, are enabled. The occurrence of lost pixel data from an entire column is eliminated or otherwise reduced, thereby increasing overall operability and yield of the imaging system. The system can be implemented on a single chip or a chip set.

Abstract: A high-speed serial interface for focal plane arrays (FPAs), such as microbolometer and cooled FPAs, is disclosed. The interface uses a serial low-voltage differential signal that is substantially unsusceptible to digital crosstalk and EMI, and provides power dissipation that is signal-independent.