Abstract: Cooling sub-systems and methods of manufacturing cooling sub-systems are provided. For example, a cooling sub-system comprises a heat exchanger and a manifold that comprises a first sensor seat and a first valve seat, which are in fluid communication with a flow of a working fluid through the heat exchanger and the manifold. The heat exchanger and manifold are integrally formed as a single unit. In some embodiments, the manifold further comprises a second sensor seat, a second valve seat, and a plurality of internal passageways, which fluidly connects the first and second sensor seats and the first and second valve seats a working fluid inlet and a working fluid outlet for an ingress of working fluid into and out of the manifold. The cooling sub-system may be manufactured by one or more additive manufacturing methods.

Abstract: Cooling sub-systems and methods of manufacturing cooling sub-systems are provided. For example, a cooling sub-system comprises a heat exchanger and a manifold that comprises a first sensor seat and a first valve seat, which are in fluid communication with a flow of a working fluid through the heat exchanger and the manifold. The heat exchanger and manifold are integrally formed as a single unit. In some embodiments, the manifold further comprises a second sensor seat, a second valve seat, and a plurality of internal passageways, which fluidly connects the first and second sensor seats and the first and second valve seats a working fluid inlet and a working fluid outlet for an ingress of working fluid into and out of the manifold. The cooling sub-system may be manufactured by one or more additive manufacturing methods.