Patents by Inventor Rosario Pogliese

Rosario Pogliese has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having alternating electrically insulative coated leads
    Patent number: 6320258
    Abstract: A package for semiconductor devices is encapsulated in an insulating resin. Multiple conductive leads project from one side of the package. Alternating leads are provided with an insulating coating which projects along a portion of their length. Leads which are not insulated are bent so as to displace them from the plane of the coated leads and space them further away from the coated leads. The bent leads are displaced a sufficient distance to provide a separation in air consistent with spacing standards for high voltage devices.
    Type: Grant
    Filed: March 23, 1994
    Date of Patent: November 20, 2001
    Assignee: Consorzio per la Ricerca Sulla Microelectronica NEL Mezzogiorno
    Inventors: Marcantonio Mangiagli, Rosario Pogliese
  • Process for encapsulating a semiconductor device having a heat sink
    Patent number: 5766985
    Abstract: A process for making a package for discrete semiconductor devices, wherein the insulating characteristics of the package are increased by introducing cuts, grooves and positioning holes in the metal plate and shaping in the retractable positioning pins of the metal plate in the molding die.
    Type: Grant
    Filed: February 6, 1995
    Date of Patent: June 16, 1998
    Assignee: Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno
    Inventors: Marcantonio Mangiagli, Rosario Pogliese
  • Resin-encapsulated semiconductor device having improved adhesion
    Patent number: 5514913
    Abstract: A package for discrete semiconductor devices, wherein the insulating characteristics of the package are improved by introducing an opening, indentations, grooves and positioning holes in the metal plate and shaping in appropriate form the retractable positioning pins of the metal plate in the molding die.
    Type: Grant
    Filed: December 7, 1992
    Date of Patent: May 7, 1996
    Assignee: Consorzio per la Ricerca sulla Microelettronica net Mezzogiorno
    Inventors: Marcantonio Mangiagli, Rosario Pogliese