Patents by Inventor Rose Ann Schultz

Rose Ann Schultz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Snap-cure epoxy adhesives
    Patent number: 5770706
    Abstract: This invention relates to adhesive formulations, which can be snap-cured without loss of adhesive strength (as measured by die shear strength) and flexibility (as measured by radius of curvature), comprising 20-80 parts by weight of a flexible epoxy resin and 80-20 parts by weight of an aromatic O-glycidyl ether (to a total 100 parts), a curing catalyst, and optionally one or more fillers.
    Type: Grant
    Filed: May 31, 1996
    Date of Patent: June 23, 1998
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Bing Wu, Quinn K. Tong, Rose Ann Schultz
  • Methyltrioxorhenium-urea hydrogen peroxide epoxidation of olefins
    Patent number: 5723636
    Abstract: A process for the epoxidation of olefins comprises contacting the olefin with urea-hydrogen peroxide in the presence of a rhenium oxide catalyst in an organic solvent.
    Type: Grant
    Filed: April 12, 1996
    Date of Patent: March 3, 1998
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Steven P. Fenelli, Rose Ann Schultz
  • Epoxy resins consisting of flexible chains terminated with glycidyloxyphenyl groups for use in microelectronics adhesives
    Patent number: 5717054
    Abstract: This invention relates to flexible epoxy resins that have a structural composition comprising an oligomeric backbone of alkylene or alkyleneoxy repeat units, terminated with an aromatic moiety bearing one or more epoxy functionalities.
    Type: Grant
    Filed: May 31, 1996
    Date of Patent: February 10, 1998
    Assignee: National Starch & Chemical Investment Holding Corp.
    Inventor: Rose Ann Schultz
  • Polyglycidylphenyl ethers of alkylene or alkyleneoxy chains for use in microelectronics adhesives
    Patent number: 5703195
    Abstract: This invention relates to flexible epoxy resins characterized by a low ionic contamination, total chlorine content less than 0.1%. The epoxy resins are liquids at room temperature, have Tg values when cured of less than or equal to 150.degree. C., have neat resin viscosities of 25,000 cps or less at 25.degree. C., and have a structural composition comprising an oligomeric backbone of alkylene repeat units, terminated with an aromatic moiety bearing one or more epoxy functionalities. The flexible epoxy resins are used in adhesives for microelectronic applications.
    Type: Grant
    Filed: November 27, 1996
    Date of Patent: December 30, 1997
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Rose Ann Schultz, Steven P. Fenelli
  • Polyglydicylphenyl ethers of alkyloxy chains for use in microelectronics adhesives
    Patent number: 5646315
    Abstract: This invention relates to flexible epoxy resins characterized by a low ionic contamination total chlorine content less than 0.1%. The epoxy resins are liquids at room temperature, have Tg values when cured of less than or equal to 150.degree. C., have neat resin viscosities of 25,000 cps or less at 25.degree. C., and have a structural composition comprising an oligomeric backbone of alkyleneoxy repeat units, terminated with an aromatic moiety bearing one or more epoxy functionalities.
    Type: Grant
    Filed: May 31, 1996
    Date of Patent: July 8, 1997
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Rose Ann Schultz, Steven P. Fenelli