Patents by Inventor Rosette Guino

Rosette Guino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140057411
    Abstract: This invention is a method for singulating a semiconductor wafer into individual semiconductor dies, the top surface of the semiconductor wafer bumped with metallic pre-connections and having a coating of underfill disposed over and around the metallic pre-connection bumps. The method comprises (A) providing a semiconductor wafer having a top surface with an array of metallic pre-connection bumps and a coating of underfill disposed over and around the metallic pre-connection bumps; (B) dicing through the underfill between the metallic pre-connection bumps and into the top surface of the semiconductor wafer to the ultimate desired wafer thickness, creating dicing lines; and (C) removing wafer material from the backside of the wafer at least to the depth of the dicing lines, thus singulating the resulting dies from the wafer.
    Type: Application
    Filed: October 31, 2013
    Publication date: February 27, 2014
    Applicant: HENKEL US IP LLC
    Inventors: Gina Hoang, YounSang Kim, Rosette Guino, Qiaohong Huang