Patents by Inventor Rosine M. Ribelin
Rosine M. Ribelin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9640706Abstract: A multi-junction photovoltaic cell includes a substrate and a back contact layer formed on the substrate. A low bandgap Group IB-IIIB-VIB2 material solar absorber layer is formed on the back contact layer. A heterojunction partner layer is formed on the low bandgap solar absorber layer, to help form the bottom cell junction, and the heterojunction partner layer includes at least one layer of a high resistivity material having a resistivity of at least 100 ohms-centimeter. The high resistivity material has the formula (Zn and/or Mg)(S, Se, O, and/or OH). A conductive interconnect layer is formed above the heterojunction partner layer, and at least one additional single-junction photovoltaic cell is formed on the conductive interconnect layer, as a top cell. The top cell may have an amorphous Silicon or p-type Cadmium Selenide solar absorber layer. Cadmium Selenide may be converted from n-type to p-type with a chloride doping process.Type: GrantFiled: April 25, 2016Date of Patent: May 2, 2017Assignee: ASCENT SOLAR TECHNOLOGIES, INCInventors: Lawrence M. Woods, Rosine M. Ribelin, Prem Nath
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Publication number: 20170062648Abstract: A multi-junction photovoltaic cell includes a substrate and a back contact layer formed on the substrate. A low bandgap Group IB-IIIB-VIB2 material solar absorber layer is formed on the back contact layer. A heterojunction partner layer is formed on the low bandgap solar absorber layer, to help form the bottom cell junction, and the heterojunction partner layer includes at least one layer of a high resistivity material having a resistivity of at least 100 ohms-centimeter. The high resistivity material has the formula (Zn and/or Mg)(S, Se, O, and/or OH). A conductive interconnect layer is formed above the heterojunction partner layer, and at least one additional single-junction photovoltaic cell is formed on the conductive interconnect layer, as a top cell. The top cell may have an amorphous Silicon or p-type Cadmium Selenide solar absorber layer. Cadmium Selenide may be converted from n-type to p-type with a chloride doping process.Type: ApplicationFiled: April 25, 2016Publication date: March 2, 2017Inventors: Lawrence M. Woods, Rosine M. Ribelin, Prem Nath
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Patent number: 9349905Abstract: A multi-junction photovoltaic cell includes a substrate and a back contact layer formed on the substrate. A low bandgap Group IB-IIIB-VIB2 material solar absorber layer is formed on the back contact layer. A heterojunction partner layer is formed on the low bandgap solar absorber layer, to help form the bottom cell junction, and the heterojunction partner layer includes at least one layer of a high resistivity material having a resistivity of at least 100 ohms-centimeter. The high resistivity material has the formula (Zn and/or Mg)(S, Se, O, and/or OH). A conductive interconnect layer is formed above the heterojunction partner layer, and at least one additional single-junction photovoltaic cell is formed on the conductive interconnect layer, as a top cell. The top cell may have an amorphous Silicon or p-type Cadmium Selenide solar absorber layer. Cadmium Selenide may be converted from n-type to p-type with a chloride doping process.Type: GrantFiled: December 9, 2013Date of Patent: May 24, 2016Assignee: ASCENT SOLAR TECHNOLOGIES, INC.Inventors: Lawrence M. Woods, Rosine M. Ribelin, Prem Nath
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Publication number: 20140099748Abstract: A multi-junction photovoltaic cell includes a substrate and a back contact layer formed on the substrate. A low bandgap Group IB-IIIB-VIB2 material solar absorber layer is formed on the back contact layer. A heterojunction partner layer is formed on the low bandgap solar absorber layer, to help form the bottom cell junction, and the heterojunction partner layer includes at least one layer of a high resistivity material having a resistivity of at least 100 ohms-centimeter. The high resistivity material has the formula (Zn and/or Mg)(S, Se, O, and/or OH). A conductive interconnect layer is formed above the heterojunction partner layer, and at least one additional single-junction photovoltaic cell is formed on the conductive interconnect layer, as a top cell. The top cell may have an amorphous Silicon or p-type Cadmium Selenide solar absorber layer. Cadmium Selenide may be converted from n-type to p-type with a chloride doping process.Type: ApplicationFiled: December 9, 2013Publication date: April 10, 2014Applicant: Ascent Solar Technologies, Inc.Inventors: Lawrence M. Woods, Rosine M. Ribelin, Prem Nath
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Publication number: 20120160313Abstract: A thin-film photovoltaic device includes a semi-transparent back contact layer. The semi-transparent back contact layer includes a semi-transparent contact layer and a semi-transparent contact interface layer. The thin-film photovoltaic device may be formed in a substrate or superstrate configuration. A tandem thin-film photovoltaic device includes a semi-transparent interconnect layer. The semi-transparent interconnect layer includes a semi-transparent contact layer and a semi-transparent contact interface layer.Type: ApplicationFiled: February 27, 2012Publication date: June 28, 2012Inventors: Lawrence M. Woods, Rosine M. Ribelin
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Patent number: 8207442Abstract: In an embodiment, one reinforced substrate for use in a photovoltaic device includes a polymer base material and a reinforcing structure bonded with the base material. The reinforced substrate presents a surface in a condition that is made-ready for deposition of thin film layers of the photovoltaic device. A thin film photovoltaic device includes the reinforced substrate, a back contact layer formed on the surface of the reinforced substrate, and a solar absorber layer formed on the back contact layer. A plurality of thin film photovoltaic devices may be formed on a common reinforced substrate. A process of producing a reinforced substrate includes combining a fluid base material and a fiber reinforcing structure to form an impregnated fiber reinforcement. The impregnated fiber reinforcement is cured to form the reinforced substrate, and the reinforced substrate is annealed.Type: GrantFiled: April 18, 2007Date of Patent: June 26, 2012Assignee: ITN Energy Systems, Inc.Inventors: Lawrence M. Woods, Joseph H. Armstrong, Rosine M. Ribelin, Thomas Duncan Barnard, Yukinari Harimoto, Hidekatsu Hatanaka, Maki Itoh, Dimitris Elias Katsoulis, Michitaka Suto, Bizhong Zhu, Nicole R. Anderson, Herschel Henry Reese
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Patent number: 8124870Abstract: A thin-film photovoltaic device includes a semi-transparent back contact layer. The semi-transparent back contact layer includes a semi-transparent contact layer and a semi-transparent contact interface layer. The thin-film photovoltaic device may be formed in a substrate or superstrate configuration. A tandem thin-film photovoltaic device includes a semi-transparent interconnect layer. The semi-transparent interconnect layer includes a semi-transparent contact layer and a semi-transparent contact interface layer.Type: GrantFiled: September 19, 2007Date of Patent: February 28, 2012Assignee: ITN Energy System, Inc.Inventors: Lawrence M. Woods, Rosine M. Ribelin
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Publication number: 20090308437Abstract: A thin-film photovoltaic device includes a semi-transparent back contact layer. The semi-transparent back contact layer includes a semi-transparent contact layer and a semi-transparent contact interface layer. The thin-film photovoltaic device may be formed in a substrate or superstrate configuration. A tandem thin-film photovoltaic device includes a semi-transparent interconnect layer. The semi-transparent interconnect layer includes a semi-transparent contact layer and a semi-transparent contact interface layer.Type: ApplicationFiled: September 19, 2007Publication date: December 17, 2009Applicant: ITN ENERGY SYSTEMS, INC.Inventors: Lawrence M. Woods, Rosine M. Ribelin
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Publication number: 20090084428Abstract: A copper indium diselenide (CIS)-based photovoltaic device includes a CIS-based solar absorber layer including copper, indium, and selenium. The CIS-based photovoltaic device further includes a substrate including a silicone layer formed from a silicone composition and a metal foil layer. The substrate, due to the presence of the silicone layer and the metal foil layer, is both flexible and sufficiently able to withstand annealing temperatures in excess of 500° C. to obtain maximum efficiency of the device.Type: ApplicationFiled: April 18, 2007Publication date: April 2, 2009Inventors: Thomas Duncan Barnard, Yukinari Harimoto, Hidekatsu Hatanaka, Maki Itoh, Dimitris Elias Katsoulis, Michitaka Suto, Bizhong Zhu, Lawrence M. Woods, Joseph H. Armstrong, Rosine M. Ribelin
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Publication number: 20090084427Abstract: A copper indium diselenide (CIS)-based photovoltaic device includes a CIS-based solar absorber layer including copper, indium, and selenium. The CIS-based photovoltaic device further includes a substrate formed from a silicone composition. The substrate, because it is formed from the silicone composition, is both flexible and sufficiently able to withstand annealing temperatures in excess of 500° C. to obtain maximum efficiency of the device.Type: ApplicationFiled: April 18, 2007Publication date: April 2, 2009Inventors: Nicole R. Anderson, Dimitris Elias Katsoulis, Herschel Henry Reese, Bizhong Zhu, Lawrence M. Woods, Joseph H. Armstrong, Rosine M. Ribelin
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Publication number: 20090020149Abstract: A multi-junction photovoltaic cell includes a substrate and a back contact layer formed on the substrate. A low bandgap Group IB-IIIB-VIB2 material solar absorber layer is formed on the back contact layer. A heterojunction partner layer is formed on the low bandgap solar absorber layer, to help form the bottom cell junction, and the heterojunction partner layer includes at least one layer of a high resistivity material having a resistivity of at least 100 ohms-centimeter. The high resistivity material has the formula (Zn and/or Mg)(S, Se, O, and/or OH). A conductive interconnect layer is formed above the heterojunction partner layer, and at least one additional single-junction photovoltaic cell is formed on the conductive interconnect layer, as a top cell. The top cell may have an amorphous Silicon or p-type Cadmium Selenide solar absorber layer. Cadmium Selenide may be converted from n-type to p-type with a chloride doping process.Type: ApplicationFiled: July 16, 2008Publication date: January 22, 2009Inventors: Lawrence M. Woods, Rosine M. Ribelin, Prem Nath
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Publication number: 20080115827Abstract: In an embodiment, one reinforced substrate for use in a photovoltaic device includes a polymer base material and a reinforcing structure bonded with the base material. The reinforced substrate presents a surface in a condition that is made-ready for deposition of thin film layers of the photovoltaic device. A thin film photovoltaic device includes the reinforced substrate, a back contact layer formed on the surface of the reinforced substrate, and a solar absorber layer formed on the back contact layer. A plurality of thin film photovoltaic devices may be formed on a common reinforced substrate. A process of producing a reinforced substrate includes combining a fluid base material and a fiber reinforcing structure to form an impregnated fiber reinforcement. The impregnated fiber reinforcement is cured to form the reinforced substrate, and the reinforced substrate is annealed.Type: ApplicationFiled: April 18, 2007Publication date: May 22, 2008Applicants: ITN ENERGY SYSTEMS, INC., DOW CORNING CORPORATIONInventors: Lawrence M Woods, Joseph H. Armstrong, Rosine M. Ribelin, Thomas Duncan Barnard, Yukinari Harimoto, Hidekatsu Hatanaka, Maki Itoh, Dimitris Elias Katsoulis, Michitaka Suto, Bizhong Zhu, Nicole R. Anderson, Herschel Henry Reese