Patents by Inventor Ross Allan KULAK

Ross Allan KULAK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11799190
    Abstract: An integrated circuit package is provided. In some examples, the integrated circuit package is an antenna-on-package package that includes a plurality of dielectric layers, a plurality of conductor layers interspersed with the plurality of dielectric layers, and an integrated circuit die disposed on a first side of the plurality of dielectric layers. The plurality of conductor layers includes a first layer disposed on a second side of the plurality of dielectric layers that includes a set of antennas. In some such examples, the integrated circuit die includes radar processing circuitry, and the AOP integrated circuit package is configured for radar applications.
    Type: Grant
    Filed: February 16, 2022
    Date of Patent: October 24, 2023
    Assignee: Texas Instruments Incorporated
    Inventors: Meysam Moallem, Ross Allan Kulak
  • Publication number: 20220173496
    Abstract: An integrated circuit package is provided. In some examples, the integrated circuit package is an antenna-on-package package that includes a plurality of dielectric layers, a plurality of conductor layers interspersed with the plurality of dielectric layers, and an integrated circuit die disposed on a first side of the plurality of dielectric layers. The plurality of conductor layers includes a first layer disposed on a second side of the plurality of dielectric layers that includes a set of antennas. In some such examples, the integrated circuit die includes radar processing circuitry, and the AOP integrated circuit package is configured for radar applications.
    Type: Application
    Filed: February 16, 2022
    Publication date: June 2, 2022
    Inventors: Meysam MOALLEM, Ross Allan KULAK
  • Patent number: 11258161
    Abstract: An integrated circuit package is provided. In some examples, the integrated circuit package is an antenna-on-package package that includes a plurality of dielectric layers, a plurality of conductor layers interspersed with the plurality of dielectric layers, and an integrated circuit die disposed on a first side of the plurality of dielectric layers. The plurality of conductor layers includes a first layer disposed on a second side of the plurality of dielectric layers that includes a set of antennas. In some such examples, the integrated circuit die includes radar processing circuitry, and the AOP integrated circuit package is configured for radar applications.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: February 22, 2022
    Assignee: Texas Instmments Incorporated
    Inventors: Meysam Moallem, Ross Allan Kulak
  • Publication number: 20200259239
    Abstract: An integrated circuit package is provided. In some examples, the integrated circuit package is an antenna-on-package package that includes a plurality of dielectric layers, a plurality of conductor layers interspersed with the plurality of dielectric layers, and an integrated circuit die disposed on a first side of the plurality of dielectric layers. The plurality of conductor layers includes a first layer disposed on a second side of the plurality of dielectric layers that includes a set of antennas. In some such examples, the integrated circuit die includes radar processing circuitry, and the AOP integrated circuit package is configured for radar applications.
    Type: Application
    Filed: September 3, 2019
    Publication date: August 13, 2020
    Inventors: Meysam MOALLEM, Ross Allan KULAK