Patents by Inventor Ross Bandy
Ross Bandy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220100078Abstract: Methods and devices for producing substrates with variable height features are provided. In one example, a proximity mask may include a plate positioned over a substrate, wherein at least a portion of the plate is separated from the substrate by a distance. The plate may include a first opening and a second opening, wherein the first opening is defined by a first perimeter having a first shape, wherein the second opening is defined by a second perimeter having a second shape, and wherein the first shape is different than the second shape.Type: ApplicationFiled: September 25, 2020Publication date: March 31, 2022Applicant: Applied Materials, Inc.Inventors: M. Arif Zeeshan, Ross Bandy, Peter F. Kurunczi, Shantanu Kallakuri, Thomas Soldi, Joseph C. Olson
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Patent number: 11232930Abstract: A carrier proximity mask and methods of assembling and using the carrier proximity mask may include providing a first carrier body, second carrier body, and set of one or more clamps. The first carrier body may have one or more openings formed as proximity masks to form structures on a first side of a substrate. The first and second carrier bodies may have one or more contact areas to align with one or more contact areas on a first and second sides of the substrate. The set of one or more clamps may clamp the substrate between the first carrier body and the second carrier body at contact areas to suspend work areas of the substrate between the first and second carrier bodies. The openings to define edges to convolve beams to form structures on the substrate.Type: GrantFiled: March 25, 2021Date of Patent: January 25, 2022Assignee: APPLIED Materials, Inc.Inventors: Morgan Evans, Charles T. Carlson, Rutger Meyer Timmerman Thijssen, Ross Bandy, Ryan Magee
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Publication number: 20210210308Abstract: A carrier proximity mask and methods of assembling and using the carrier proximity mask may include providing a first carrier body, second carrier body, and set of one or more clamps. The first carrier body may have one or more openings formed as proximity masks to form structures on a first side of a substrate. The first and second carrier bodies may have one or more contact areas to align with one or more contact areas on a first and second sides of the substrate. The set of one or more clamps may clamp the substrate between the first carrier body and the second carrier body at contact areas to suspend work areas of the substrate between the first and second carrier bodies. The openings to define edges to convolve beams to form structures on the substrate.Type: ApplicationFiled: March 25, 2021Publication date: July 8, 2021Applicant: APPLIED Materials, Inc.Inventors: Morgan Evans, Charles T. Carlson, Rutger Meyer Timmerman Thijssen, Ross Bandy, Ryan Magee
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Patent number: 10991547Abstract: A carrier proximity mask and methods of assembling and using the carrier proximity mask may include providing a first carrier body, second carrier body, and set of one or more clamps. The first carrier body may have one or more openings formed as proximity masks to form structures on a first side of a substrate. The first and second carrier bodies may have one or more contact areas to align with one or more contact areas on a first and second sides of the substrate. The set of one or more clamps may clamp the substrate between the first carrier body and the second carrier body at contact areas to suspend work areas of the substrate between the first and second carrier bodies. The openings to define edges to convolve beams to form structures on the substrate.Type: GrantFiled: September 25, 2019Date of Patent: April 27, 2021Assignee: Applied Materials, Inc.Inventors: Morgan Evans, Charles T. Carlson, Rutger Meyer Timmerman Thijssen, Ross Bandy, Ryan Magee
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Publication number: 20210090843Abstract: A carrier proximity mask and methods of assembling and using the carrier proximity mask may include providing a first carrier body, second carrier body, and set of one or more clamps. The first carrier body may have one or more openings formed as proximity masks to form structures on a first side of a substrate. The first and second carrier bodies may have one or more contact areas to align with one or more contact areas on a first and second sides of the substrate. The set of one or more clamps may clamp the substrate between the first carrier body and the second carrier body at contact areas to suspend work areas of the substrate between the first and second carrier bodies. The openings to define edges to convolve beams to form structures on the substrate.Type: ApplicationFiled: September 25, 2019Publication date: March 25, 2021Applicant: APPLIED Materials, Inc.Inventors: Morgan Evans, Charles T. Carlson, Rutger Meyer Timmerman Thijssen, Ross Bandy
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Publication number: 20210090858Abstract: A carrier proximity mask and methods of assembling and using the carrier proximity mask may include providing a first carrier body, second carrier body, and set of one or more clamps. The first carrier body may have one or more openings formed as proximity masks to form structures on a first side of a substrate. The first and second carrier bodies may have one or more contact areas to align with one or more contact areas on a first and second sides of the substrate. The set of one or more clamps may clamp the substrate between the first carrier body and the second carrier body at contact areas to suspend work areas of the substrate between the first and second carrier bodies. The openings to define edges to convolve beams to form structures on the substrate.Type: ApplicationFiled: September 25, 2019Publication date: March 25, 2021Applicant: APPLIED Materials, Inc.Inventors: Morgan Evans, Charles T. Carlson, Rutger Meyer Timmerman Thijssen, Ross Bandy, Ryan Magee
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Patent number: 10957512Abstract: A carrier proximity mask and methods of assembling and using the carrier proximity mask may include providing a first carrier body, second carrier body, and set of one or more clamps. The first carrier body may have one or more openings formed as proximity masks to form structures on a first side of a substrate. The first and second carrier bodies may have one or more contact areas to align with one or more contact areas on a first and second sides of the substrate. The set of one or more clamps may clamp the substrate between the first carrier body and the second carrier body at contact areas to suspend work areas of the substrate between the first and second carrier bodies. The openings to define edges to convolve beams to form structures on the substrate.Type: GrantFiled: September 25, 2019Date of Patent: March 23, 2021Assignee: Applied Materials, Inc.Inventors: Morgan Evans, Charles T. Carlson, Rutger Meyer Timmerman Thijssen, Ross Bandy
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Patent number: 10847372Abstract: Methods for processing of a workpiece are disclosed. The actual rate at which different portions of an ion beam can process a workpiece, referred to as the processing rate profile, is determined by measuring the amount of material removed from, or added to, a workpiece by the ion beam as a function of ion beam position. An initial thickness profile of a workpiece to be processed is determined. Based on the initial thickness profile, a target thickness profile, and the processing rate profile of the ion beam, a first set of processing parameters are determined. The workpiece is then processed using this first set of processing parameters. In some embodiments, an updated thickness profile is determined after the first process and a second set of processing parameters are determined. A second process is performed using the second set of processing parameters. Optimizations to improve throughput are also disclosed.Type: GrantFiled: September 26, 2018Date of Patent: November 24, 2020Assignee: Varian Semiconductor Equipment Associates, Inc.Inventors: Morgan D. Evans, Kevin Anglin, Ross Bandy
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Publication number: 20190027367Abstract: Methods for processing of a workpiece are disclosed. The actual rate at which different portions of an ion beam can process a workpiece, referred to as the processing rate profile, is determined by measuring the amount of material removed from, or added to, a workpiece by the ion beam as a function of ion beam position. An initial thickness profile of a workpiece to be processed is determined. Based on the initial thickness profile, a target thickness profile, and the processing rate profile of the ion beam, a first set of processing parameters are determined. The workpiece is then processed using this first set of processing parameters. In some embodiments, an updated thickness profile is determined after the first process and a second set of processing parameters are determined. A second process is performed using the second set of processing parameters. Optimizations to improve throughput are also disclosed.Type: ApplicationFiled: September 26, 2018Publication date: January 24, 2019Inventors: Morgan D. Evans, Kevin Anglin, Ross Bandy
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Patent number: 9960089Abstract: An apparatus to control processing conditions for a substrate. The apparatus may include a current measurement component to perform a plurality of extraction current measurements for extraction current in a processing apparatus housing the substrate, the extraction current comprising ions extracted from a plasma and directed to the substrate; and an endpoint detection component comprising logic to generate an endpoint detection signal based upon a change in extraction current during the plurality of extraction current measurements.Type: GrantFiled: April 3, 2015Date of Patent: May 1, 2018Assignee: Varian Semiconductor Equipment Associates, Inc.Inventors: Morgan Evans, Ross Bandy
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Publication number: 20170005013Abstract: Methods for processing of a workpiece are disclosed. The actual rate at which different portions of an ion beam can process a workpiece, referred to as the processing rate profile, is determined by measuring the amount of material removed from, or added to, a workpiece by the ion beam as a function of ion beam position. An initial thickness profile of a workpiece to be processed is determined. Based on the initial thickness profile, a target thickness profile, and the processing rate profile of the ion beam, a first set of processing parameters are determined. The workpiece is then processed using this first set of processing parameters. In some embodiments, an updated thickness profile is determined after the first process and a second set of processing parameters are determined. A second process is performed using the second set of processing parameters. Optimizations to improve throughput are also disclosed.Type: ApplicationFiled: June 30, 2015Publication date: January 5, 2017Inventors: Morgan D. Evans, Kevin Anglin, Ross Bandy
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Publication number: 20160293503Abstract: An apparatus to control processing conditions for a substrate. The apparatus may include a current measurement component to perform a plurality of extraction current measurements for extraction current in a processing apparatus housing the substrate, the extraction current comprising ions extracted from a plasma and directed to the substrate; and an endpoint detection component comprising logic to generate an endpoint detection signal based upon a change in extraction current during the plurality of extraction current measurements.Type: ApplicationFiled: April 3, 2015Publication date: October 6, 2016Inventors: Morgan Evans, Ross Bandy