Abstract: Methods of bonding a pressure-sensitive adhesive to a substrate are provided. The methods include heating a styrenic block copolymer composition to provide an adhesive melt composition, wherein the styrenic block copolymer composition contains a hard segment block with a glass transition temperature of from 90° C. to 220° C.; masticating the adhesive melt composition; delivering the adhesive melt composition onto the substrate at a temperature that exceeds the glass transition temperature of the hard segment block by from 20° C. to 150° C.; and cooling the adhesive melt composition to obtain a bonded pressure-sensitive adhesive. Optionally, the substrate can be a non-film substrate, or the styrenic block copolymer composition can be provided in a core-sheath filament that includes a styrenic block copolymer core and a sheath that is non-tacky at ambient temperature.

Abstract: An article includes a patterned substrate including a substrate surface with an inorganic electro-conductive trace adjacent thereto (wherein the substrate and the inorganic material of the trace each has an index of refraction), and a layer including a polymerized acrylate matrix adjacent to at least a portion of the surface of the substrate and the inorganic electro-conductive trace, wherein the layer has an index of refraction that is within ±10% of the average of the indices of refraction of the substrate and the inorganic material of the trace.