Patents by Inventor Ross Frushour

Ross Frushour has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Rigid-backed, membrane-based chip tooling
    Patent number: 8197626
    Abstract: An apparatus for use with multiple individual chips having a rigid plate, and a deformable membrane located on the plate, the deformable membrane having a thickness sufficient to allow the deformable membrane to peripherally conform to each of the individual multiple chips irrespective of any difference in height among the multiple individual chips and to prevent each of the multiple individual chips from moving in a lateral direction, the deformable membrane being configured to uniformly transfer a vertical force, applied to the rigid plate, to the chips so as to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the individual chips will be bonded during a connect and release cycle without causing damage to the individual chips or bonding surface.
    Type: Grant
    Filed: April 14, 2011
    Date of Patent: June 12, 2012
    Assignee: Cufer Asset Ltd. L.L.C.
    Inventors: John Trezza, Ross Frushour
  • Pin-type chip tooling
    Patent number: 8197627
    Abstract: An apparatus for use with multiple chips having multiple posts as to engage at least a portion of a surface of one of the multiple chips, a frame configured to releasably constrain each of the posts so that, when unconstrained, each individual post can contact an individual chip and, when constrained, will allow a uniform vertical force to be applied to the chips.
    Type: Grant
    Filed: April 15, 2011
    Date of Patent: June 12, 2012
    Assignee: Cufer Asset Ltd. L.L.C.
    Inventors: John Trezza, Ross Frushour
  • PIN-TYPE CHIP TOOLING
    Publication number: 20110223717
    Abstract: An apparatus for use with multiple chips having multiple posts as to engage at least a portion of a surface of one of the multiple chips, a frame configured to releasably constrain each of the posts so that, when unconstrained, each individual post can contact an individual chip and, when constrained, will allow a uniform vertical force to be applied to the chips.
    Type: Application
    Filed: April 15, 2011
    Publication date: September 15, 2011
    Inventors: John Trezza, Ross Frushour
  • RIGID-BACKED, MEMBRANE-BASED CHIP TOOLING
    Publication number: 20110212573
    Abstract: An apparatus for use with multiple individual chips having a rigid plate, and a deformable membrane located on the plate, the deformable membrane having a thickness sufficient to allow the deformable membrane to peripherally conform to each of the individual multiple chips irrespective of any difference in height among the multiple individual chips and to prevent each of the multiple individual chips from moving in a lateral direction, the deformable membrane being configured to uniformly transfer a vertical force, applied to the rigid plate, to the chips so as to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the individual chips will be bonded during a connect and release cycle without causing damage to the individual chips or bonding surface.
    Type: Application
    Filed: April 14, 2011
    Publication date: September 1, 2011
    Inventors: John Trezza, Ross Frushour
  • Pin-type chip tooling
    Patent number: 7946331
    Abstract: An apparatus for use with multiple chips having multiple posts as to engage at least a portion of a surface of one of the multiple chips, a frame configured to releasably constrain each of the posts so that, when unconstrained, each individual post can contact an individual chip and, when constrained, will allow a uniform vertical force to be applied to the chips.
    Type: Grant
    Filed: January 10, 2006
    Date of Patent: May 24, 2011
    Assignee: Cufer Asset Ltd. L.L.C.
    Inventors: John Trezza, Ross Frushour
  • Rigid-backed, membrane-based chip tooling
    Patent number: 7942182
    Abstract: An apparatus for use with multiple individual chips having a rigid plate, and a deformable membrane located on the plate, the deformable membrane having a thickness sufficient to allow the deformable membrane to peripherally conform to each of the individual multiple chips irrespective of any difference in height among the multiple individual chips and to prevent each of the multiple individual chips from moving in a lateral direction, the deformable membrane being configured to uniformly transfer a vertical force, applied to the rigid plate, to the chips so as to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the individual chips will be bonded during a connect and release cycle without causing damage to the individual chips or bonding surface.
    Type: Grant
    Filed: January 10, 2006
    Date of Patent: May 17, 2011
    Assignee: Cufer Asset Ltd. L.L.C.
    Inventors: John Trezza, Ross Frushour
  • Pin-type chip tooling
    Publication number: 20070120241
    Abstract: An apparatus for use with multiple chips having multiple posts as to engage at least a portion of a surface of one of the multiple chips, a frame configured to releasably constrain each of the posts so that, when unconstrained, each individual post can contact an individual chip and, when constrained, will allow a uniform vertical force to be applied to the chips.
    Type: Application
    Filed: January 10, 2006
    Publication date: May 31, 2007
    Inventors: John Trezza, Ross Frushour
  • Rigid-backed, membrane-based chip tooling
    Publication number: 20060281292
    Abstract: An apparatus for use with multiple individual chips having a rigid plate, and a deformable membrane located on the plate, the deformable membrane having a thickness sufficient to allow the deformable membrane to peripherally conform to each of the individual multiple chips irrespective of any difference in height among the multiple individual chips and to prevent each of the multiple individual chips from moving in a lateral direction, the deformable membrane being configured to uniformly transfer a vertical force, applied to the rigid plate, to the chips so as to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the individual chips will be bonded during a connect and release cycle without causing damage to the individual chips or bonding surface.
    Type: Application
    Filed: January 10, 2006
    Publication date: December 14, 2006
    Inventors: John Trezza, Ross Frushour