Abstract: A method is described for selectively depositing a metallic layer (10) including one or more of copper, silver and gold. The method includes depositing a fluorinated layer (5) over a surface (1, 4). The fluorinated layer (5) has a thickness sufficient to substantially prevent deposition of the copper, silver and/or gold between the fluorinated layer (5) and the surface (1, 4) during a subsequent evaporation step using a given deposition rate. The method also includes forming the metallic layer (10) by evaporating, at the given deposition rate, the copper, silver and/or gold over the surface (1, 4) and the fluorinated layer (5). The copper, silver and/or gold preferentially adhere to the portions of the surface (1, 4) not covered by the fluorinated layer (s).

Abstract: A photosensitive optoelectronic device (1) comprises a plurality of organic semiconductor sub-cells (10, 11, 12, 13) arranged in a stack between electrodes (3, 5), each sub-cell comprising donor material (14, 16, 23, 25) and acceptor material (15, 17, 24, 26) providing a heterojunction. There is a recombination layer (19, 22, 28) between adjacent sub-cells. The sub-cells are arranged in two groups (20, 29). The sub-cells (10, 11; 12, 13) within a group (20; 29) are responsive over substantially the same part of the light spectrum. The groups (20, 29) differ substantially from each other in respect of the parts of the light spectrum over which their respective sub-cells are responsive.