Patents by Inventor Ross Michael Mahan

Ross Michael Mahan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • POLYMERIC SUBSTRATE INCLUDING A BARRIER LAYER
    Publication number: 20230407071
    Abstract: A polymeric substrate is disclosed. The polymeric substrate comprises a barrier layer including a polymeric material comprising about 50 wt. % or more of at least one polyolefin polymer and 50 wt. % or less of a hydrocarbon resin. The polymeric material exhibits a DTUL of 30° C. or more and a tensile modulus of 500 MPa or more and/or a flexural secant modulus of 500 MPa or more. The barrier layer has a thickness of greater than 200 ?m to 6,500 ?m. A shaped polymeric article comprising the polymeric substrate is also disclosed.
    Type: Application
    Filed: August 29, 2023
    Publication date: December 21, 2023
    Inventors: Billy R. Bodiford, Ross Michael Mahan
  • Polymeric substrate including a barrier layer
    Patent number: 11781000
    Abstract: A polymeric substrate is disclosed. The polymeric substrate comprises a barrier layer including a polymeric material comprising about 50 wt. % or more of at least one polyolefin polymer and 50 wt. % or less of a hydrocarbon resin. The polymeric material exhibits a DTUL of 30° C. or more and a tensile modulus of 500 MPa or more and/or a flexural secant modulus of 500 MPa or more. The barrier layer has a thickness of greater than 200 ?m to 6,500 ?m. A shaped polymeric article comprising the polymeric substrate is also disclosed.
    Type: Grant
    Filed: October 13, 2022
    Date of Patent: October 10, 2023
    Assignee: INV Polypropylene, LLC
    Inventors: Billy R. Bodiford, Ross Michael Mahan
  • POLYMERIC SUBSTRATE INCLUDING A BARRIER LAYER
    Publication number: 20230057559
    Abstract: A polymeric substrate is disclosed. The polymeric substrate comprises a barrier layer including a polymeric material comprising about 50 wt. % or more of at least one polyolefin polymer and 50 wt. % or less of a hydrocarbon resin. The polymeric material exhibits a DTUL of 30° C. or more and a tensile modulus of 500 MPa or more and/or a flexural secant modulus of 500 MPa or more. The barrier layer has a thickness of greater than 200 ?m to 6,500 ?m. A shaped polymeric article comprising the polymeric substrate is also disclosed.
    Type: Application
    Filed: October 13, 2022
    Publication date: February 23, 2023
    Applicant: INV Polypropylene, LLC
    Inventors: Billy R. BODIFORD, Ross Michael MAHAN
  • Polymeric substrate including a barrier layer
    Patent number: 11512193
    Abstract: A polymeric substrate is disclosed. The polymeric substrate comprises a barrier layer including a polymeric material comprising about 50 wt. % or more of at least one polyolefin polymer and 50 wt. % or less of a hydrocarbon resin. The polymeric material exhibits a DTUL of 30° C. or more and a tensile modulus of 500 MPa or more and/or a flexural secant modulus of 500 MPa or more. The barrier layer has a thickness of greater than 200 ?m to 6,500 ?m. A shaped polymeric article comprising the polymeric substrate is also disclosed.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: November 29, 2022
    Inventors: Ross Michael Mahan, Billy R. Bodiford
  • POLYMERIC SUBSTRATE INCLUDING A BARRIER LAYER
    Publication number: 20210206954
    Abstract: A polymeric substrate is disclosed. The polymeric substrate comprises a barrier layer including a polymeric material comprising about 50 wt. % or more of at least one polyolefin polymer and 50 wt. % or less of a hydrocarbon resin. The polymeric material exhibits a DTUL of 30° C. or more and a tensile modulus of 500 MPa or more and/or a flexural secant modulus of 500 MPa or more. The barrier layer has a thickness of greater than 200 ?m to 6,500 ?m. A shaped polymeric article comprising the polymeric substrate is also disclosed.
    Type: Application
    Filed: December 11, 2020
    Publication date: July 8, 2021
    Inventors: Ross Michael Mahan, Billy R. Bodiford
  • ABS substrate extrusion process
    Patent number: 6080473
    Abstract: The process for manufacturing extruded ABS products includes recycling used ABS to produce a recycled ABS exhibiting predetermined characteristics and extruding the recycled ABS to produce an ABS product.
    Type: Grant
    Filed: March 17, 1999
    Date of Patent: June 27, 2000
    Assignee: Premark RWP Holdings, Inc.
    Inventors: Anthony S. Oriseh, Mark T. Krejchi, Robson M. Mafoti, Ross Michael Mahan, Yein Ming Lee, Peter C. Gaa