Patents by Inventor Rouh Huey Uang

Rouh Huey Uang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composite conductive film and semiconductor package using such film
    Patent number: 7932607
    Abstract: A composite conductive film and a semiconductor package using such film are provided. The composite conductive film is formed of a polymer-matrix and a plurality of nano-sized conductive lines is provided. The composite conductive film has low resistance, to connect between a fine-pitch chip and a chip in a low temperature and low pressure condition. The conductive lines are parally arranged and spaced apart from each other, to provide anisotropic conductivity.
    Type: Grant
    Filed: December 18, 2008
    Date of Patent: April 26, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Rouh-Huey Uang, Yu-Chih Chen
  • COMPOSITE CONDUCTIVE FILM AND SEMICONDUCTOR PACKAGE USING SUCH FILM
    Publication number: 20090095503
    Abstract: A composite conductive film and a semiconductor package using such film are provided. The composite conductive film is formed of a polymer-matrix and a plurality of nano-sized conductive lines is provided. The composite conductive film has low resistance, to connect between a fine-pitch chip and a chip in a low temperature and low pressure condition. The conductive lines are parally arranged and spaced apart from each other, to provide anisotropic conductivity.
    Type: Application
    Filed: December 18, 2008
    Publication date: April 16, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Rouh Huey Uang, Yu-Chih Chen
  • Composite conductive film and semiconductor package using such film
    Patent number: 7479702
    Abstract: A composite conductive film and a semiconductor package using such film are provided. The composite conductive film is formed of a polymer-matrix and a plurality of nano-sized conductive lines is provided. The composite conductive film has low resistance, to connect between a fine-pitch chip and a chip in a low temperature and low pressure condition. The conductive lines are parally arranged and spaced apart from each other, to provide anisotropic conductivity. The present conductive film can be served as an electrical connection between a fine-pitch chip and a chip or a fine-pitch chip and a substrate.
    Type: Grant
    Filed: January 18, 2006
    Date of Patent: January 20, 2009
    Assignee: Industrial Technology Research Institute
    Inventors: Rouh Huey Uang, Yu-Chih Chen