Abstract: A solder paste composition containing (a) 4-96% by weight finely divided particles of eutectic or pseudo-eutectic metal alloy or mixtures; (b) 96-4% by weight finely divided particles of a metal additive consisting of pure metal, mixtures or alloys thereof having a melting point of at least 30.degree. C. greater than the metal alloy in (a); and (c) an organic medium. The paste is particularly useful for surface mounting metallized components to metallized substrates in microelectronic packaging.

Abstract: A process for brazing a metallized component to a metallized ceramic-based substrate comprising the steps of:(a) applying a second conductor composition over the metallizations on the substrate such that the metallizations are covered by said second conductor composition which consists essentially of a metal powder and an organic medium;(b) drying said second conductor composition;(c) firing said second conductor composition at a temperature sufficient to sinter the metal powder of the second conductor composition and drive off said organic medium thereby forming a second metallization layer;(d) forming an assembly by positioning at least one metallized component on said second metallization layer and a brazing composition at the component-second metallization layer interface; and(e) heating said assembly at a temperature sufficient for said brazing composition to form a joint between said component and said second metallization layer.

Abstract: A method to measure the real contact surface area of a connector or pin is disclosed. The pin and the connector is Gold plated. The pin or the connector is coated with platinum. The pin surface and the connector surface actually comprise a multitude of peaks and valleys, termed asperites. If the pin is chosen to be coated with the platinum, the platinum coated pin is mated with a connector. A portion of the pin surface contacts a corresponding portion of the connector surface. The portion of the pin surface and the corresponding portion of the connector surface is termed a real contact surface area. The pin and connector are separated. The platinum formerly adhering to the real contact surface area of the pin is removed and adheres to the real contact surface of the gold plated connector. Using a metallograph or a scanning electron microscope, the real contact surface of the connector or pin is studied and observed.