Patents by Inventor Roupen Leon Keusseyan
Roupen Leon Keusseyan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11646246Abstract: Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.Type: GrantFiled: November 17, 2017Date of Patent: May 9, 2023Assignee: SAMTEC, INC.Inventors: Tim Mobley, Roupen Leon Keusseyan
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Publication number: 20220059436Abstract: Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to ta second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.Type: ApplicationFiled: November 8, 2021Publication date: February 24, 2022Inventors: Tim Mobley, Roupen Leon Keusseyan
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Patent number: 11251109Abstract: Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.Type: GrantFiled: November 17, 2017Date of Patent: February 15, 2022Assignee: SAMTEC, INC.Inventors: Tim Mobley, Roupen Leon Keusseyan
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Publication number: 20190322572Abstract: Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.Type: ApplicationFiled: November 17, 2017Publication date: October 24, 2019Inventors: Tim MOBLEY, Roupen Leon KEUSSEYAN
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Publication number: 20190326130Abstract: Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.Type: ApplicationFiled: November 17, 2017Publication date: October 24, 2019Inventors: Tim MOBLEY, Roupen Leon KEUSSEYAN
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Publication number: 20190304877Abstract: Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.Type: ApplicationFiled: November 17, 2017Publication date: October 3, 2019Inventors: Tim MOBLEY, Roupen Leon KEUSSEYAN
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Patent number: 9374892Abstract: A paste material for filling a through-hole for improved adhesion and hermeticity in glass substrates. In some embodiments, the paste material comprises a metal, a glass frit composition, a solvent, a resin, a conductive or non-conductive inert additive, or mixtures thereof. The paste material has improved adhesion to the through-holes. The filled through-holes are hermetic and have a low resistivity.Type: GrantFiled: December 12, 2014Date of Patent: June 21, 2016Assignee: TRITON MICROTECHNOLOGIESInventors: Tim Mobley, Roupen Leon Keusseyan
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Patent number: 9337060Abstract: A glass substrate and method of processing the glass substrate for use in semi-conductor packaging applications. The glass substrate has top surface and a bottom surface. At least one through-hole extends from the top surface to the bottom surface of the glass substrate. At least one interior layer is disposed inside the through-hole. At least one external layer is disposed on the top surface and at least one external layer is disposed on the bottom surface. The through holes of the glass substrate are filled with a metallized paste material using thick film technology. The glass substrate is planarized after metallization to clean and flatten a surface of the glass substrate. The surface of the glass substrate is coated with at least one redistribution layer of a metal, a metal oxide, an alloy, a polymer, or a combination thereof. The paste material has improved adhesion to the through-holes. The filled through-holes are hermetic and have a low resistivity.Type: GrantFiled: December 12, 2014Date of Patent: May 10, 2016Assignee: TRITON MICROTECHNOLOGIESInventors: Tim Mobley, Roupen Leon Keusseyan
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Patent number: 9236274Abstract: A method of processing a glass substrate for use in semi-conductor packaging applications. Through holes are created in a glass substrate and subsequently filled with a metallized paste material. The glass substrate is planarized after metallization to clean and flatten a surface of the glass substrate. The surface of the glass substrate is coated with at least one redistribution layer of a metal, a metal oxide, an alloy, a polymer, or a combination thereof. The paste material has improved adhesion to the through-holes. The filled through-holes are hermetic and have a low resistivity.Type: GrantFiled: December 12, 2014Date of Patent: January 12, 2016Assignee: TRITON MICROTECHNOLOGIESInventors: Tim Mobley, Roupen Leon Keusseyan
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Patent number: 9184135Abstract: A system for backside metallization and reinforcement of glass substrates to provide support and protection during handling and processing of the glass substrates. A sacrificial substrate is removeably attached to a glass substrate comprising through-holes, backside metallized pads, and under-bump metallization (UBM) pads enclosing the backside metallized pads. The sacrificial substrate comprises a sacrificial layer, an opaque film, and an adhesive. The sacrificial substrate protects the backside metallized pads and UBM pads, and reinforces the glass substrate.Type: GrantFiled: December 12, 2014Date of Patent: November 10, 2015Assignee: TRINTON MICROTECHNOLOGIESInventors: Tim Mobley, Roupen Leon Keusseyan, Charles Tucker
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Patent number: 9184064Abstract: A method for backside metallization and reinforcement of glass substrates to provide support and protection during handling and processing of the glass substrates. Through-holes are created in a glass substrate and filled with a conductive type material. Backside metallized pads are applied to the glass substrate and enclosed with an under-bump metallization (UBM) pad. A sacrificial substrate is removeably attached to the glass substrate. The sacrificial substrate comprises a sacrificial layer, an opaque film, and an adhesive. The sacrificial substrate protects the backside metallized pads and under-bump metallization (UBM) pads, and reinforces the glass substrate.Type: GrantFiled: December 12, 2014Date of Patent: November 10, 2015Assignee: TRITON MICROTECHNOLOGIESInventors: Tim Mobley, Roupen Leon Keusseyan, Charles Tucker
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Patent number: 8440383Abstract: Thermal imaging donors are useful for thermal transfer patterning of a metal layer and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers. These include electromagnetic interference shields and touchpad sensors.Type: GrantFiled: January 26, 2011Date of Patent: May 14, 2013Assignee: E I du Pont de Nemours and CompanyInventors: Richard Kevin Bailey, Graciela Beatriz Blanchet, Jonathan V. Caspar, John Catron, Jr., Reid John Chesterfield, Thomas C. Felder, Feng Gao, Lynda Kaye Johnson, Roupen Leon Keusseyan, Dalen E. Keys, Irina Malajovich, Jeffrey Scott Meth, Geoffrey Nunes, Gerard O'Neil, Rinaldo Soria Schiffino, Nancy G. Tassi
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Publication number: 20110151214Abstract: Thermal imaging donors are useful for thermal transfer patterning of a metal layer and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers. These include electromagnetic interference shields and touchpad sensors.Type: ApplicationFiled: January 26, 2011Publication date: June 23, 2011Applicant: E.I.DU PONT DE NEMOURS AND COMPANYInventors: Richard Kevin Bailey, Graciela Beatriz Blanchet, Jonathan V. Caspar, John Catron, Reid John Chesterfield, Thomas C. Felder, Feng Gao, Lynda Kaye Johnson, Roupen Leon Keusseyan, Dalen E. Keys, Irina Malajovich, Jeffrey Scott Meth, Geoffrey Nunes, Gerard O'Nell, Rinaldo S. Schiffino, Nancy G. Tassi
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Patent number: 7901596Abstract: Metal compositions including silver compositions are used in preparing thermal imaging donors. The donors are useful for thermal transfer patterning of a metal layer and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers, including EMI shields and touchpad sensors.Type: GrantFiled: June 19, 2009Date of Patent: March 8, 2011Assignee: E.I. du Pont de Nemours and CompanyInventors: Richard Kevin Bailey, Graciela Beatriz Blanchet, Jonathan V Caspar, John Catron, Jr., Reid John Chesterfield, Thomas C. Felder, Feng Gao, Lynda Kaye Johnson, Roupen Leon Keusseyan, Dalen E. Keys, Irina Malajovich, Jeffrey Scott Meth, Geoffrey Nunes, Gerard O'Neil, Rinaldo Soria Schiffino, Nancy G. Tassi
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Patent number: 7744717Abstract: Provided are processes for enhancing the resolution of a thermally transferred pattern on an imaged thermal transfer receiver, wherein the imaged thermal transfer receiver comprises a surface having an exposed portion and a non-exposed portion of one or more thermally transferred layer(s), comprising: (a) contacting said surface with an adhesive layer for a contact period to provide a laminate; (b) separating said adhesive layer from the laminate to provide a treated thermal transfer receiver having a surface substantially free of said non-exposed portion of one or more thermally transferred layer(s). The processes are useful in the fabrication of electronic devices including thin film transistors, circuits, electromagnetic interference shields, touchpad sensors and other electronic devices.Type: GrantFiled: April 25, 2007Date of Patent: June 29, 2010Assignee: E. I. du Pont de Nemours and CompanyInventors: Gerald Donald Andrews, Richard Kevin Bailey, Graciela Beatriz Blanchet, John W. Catron, Feng Gao, Gary Delmar Jaycox, Lynda Kaye Johnson, Roupen Leon Keusseyan, Jeffrey Scott Meth, Frank S. Principe, Rinaldo S. Schiffino, Robert Mar Yohannan
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Patent number: 7741013Abstract: A process for patterning thick film electrically functional patterns using a photosensitive polymer layer. A tacky photosensitive layer is applied onto a substrate surface. The photosensitive layer is imaged with a pattern using actinic radiation, the exposed areas of the photosensitive layer become hardened and non-tacky. A subsequent application of a thick film composition sheet will cause the thick film to adhere to the remaining tacky areas. Upon peeling the sheet, a thick film print pattern will be produced. This step is followed by a processing profile prescribed by the thick film composition used which results in a pattern having electrically functional properties. The invention also extends to a process wherein a thick film composition is recovered from a used sheet.Type: GrantFiled: February 21, 2006Date of Patent: June 22, 2010Assignee: E.I. du Pont de Nemours and CompanyInventor: Roupen Leon Keusseyan
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Publication number: 20100104829Abstract: A process for patterning thick film electrically functional patterns using a photosensitive polymer layer. A tacky photosensitive layer is applied onto a substrate surface. The photosensitive layer is imaged with a pattern using actinic radiation, the exposed areas of the photosensitive layer become hardened and non-tacky. A subsequent application of a thick film composition sheet will cause the thick film to adhere to the remaining tacky areas. Upon peeling the sheet, a thick film print pattern will be produced. This step is followed by a processing profile prescribed by the thick film composition used which results in a pattern having electrically functional properties. The invention also extends to a process wherein a thick film composition is recovered from a used sheet.Type: ApplicationFiled: December 28, 2009Publication date: April 29, 2010Applicant: E.I.DU PONT DE NEMOURS AND COMPANYInventor: ROUPEN LEON KEUSSEYAN
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Patent number: 7666567Abstract: Disclosed is a method negative imaging method for making a metal pattern with high conductivity comprising providing a patterned substrate comprising a patterned catalyst layer on a base substrate by a thermal imaging method followed by plating to provide the metal pattern. The metal patterns provided are suitable for electrical devices including electromagnetic interference shielding devices and touchpad sensors.Type: GrantFiled: October 23, 2007Date of Patent: February 23, 2010Assignee: E. I. du Pont de Nemours and CompanyInventors: Feng Gao, Lynda Kaye Johnson, Roupen Leon Keusseyan, Irina Malajovich, Jeffrey Scott Meth, Kenneth George Sharp, Fredrick Claus Zumsteg, Jr., Seema Agrawal
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Patent number: 7666568Abstract: Disclosed is a method for making a metal pattern with high conductivity comprising providing a patterned substrate comprising a patterned catalyst layer on a base substrate by a thermal imaging method followed by plating to provide the metal pattern. The metal patterns provided are suitable for electrical devices including electromagnetic interference shielding devices and touchpad sensors.Type: GrantFiled: October 23, 2007Date of Patent: February 23, 2010Assignee: E. I. du Pont de Nemours and CompanyInventors: Feng Gao, Lynda Kaye Johnson, Roupen Leon Keusseyan, Dalen E. Keys, Irina Malajovich, Rinaldo S. Schiffino, Fredrick Claus Zumsteg, Jr.
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Publication number: 20090297739Abstract: The invention provides metal compositions, including silver compositions, and thermal imaging donors prepared with the compositions. The donors are useful for thermal transfer patterning of a metal layers and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers, including EMI shields and touchpad sensors.Type: ApplicationFiled: June 19, 2009Publication date: December 3, 2009Applicant: E.I. DU PONT DE NEMOURS AND COMPANYInventors: Richard Kevin Baily, Graciela Beatriz Blanchet, Jonathan V. Caspar, John Catron, Reid John Chesterfield, Thomas C. Felder, Feng Gao, Lynda Kaye Johnson, Roupen Leon Keusseyan, Dalen E. Keys, Irina Malajovich, Jeffrey Scott Meth, Geoffrey Nunes, Gerard O'Neil, Rinaldo S. Schiffino, Nancy G. Tassi