Patents by Inventor Roveluz Lledo-Reyes

Roveluz Lledo-Reyes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 11505452
    Abstract: A semiconductor device may include a first substrate, a first electrical component, a lid, a second substrate, and a second electrical component. The first substrate may include an upper surface, a lower surface, and an upper cavity in the upper surface. The first electrical component may reside in the upper cavity of the first substrate. The lid may cover the upper cavity and may include a port that permits fluid to flow between an environment external to the semiconductor device and the upper cavity. The second substrate may include the second electrical component mounted to an upper surface of the second substrate. The lower surface of the first substrate and the upper surface of the second substrate may fluidically seal the second electrical component from the upper cavity.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: November 22, 2022
    Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
    Inventors: Lawrence Prestousa Natan, Adrian Arcedera, Roveluz Lledo-Reyes, Sarah Christine-Sanchez Torrefranca
  • SEMICONDUCTOR DEVICE
    Publication number: 20210047173
    Abstract: A semiconductor device may include a first substrate, a first electrical component, a lid, a second substrate, and a second electrical component. The first substrate may include an upper surface, a lower surface, and an upper cavity in the upper surface. The first electrical component may reside in the upper cavity of the first substrate. The lid may cover the upper cavity and may include a port that permits fluid to flow between an environment external to the semiconductor device and the upper cavity. The second substrate may include the second electrical component mounted to an upper surface of the second substrate. The lower surface of the first substrate and the upper surface of the second substrate may fluidically seal the second electrical component from the upper cavity.
    Type: Application
    Filed: October 30, 2020
    Publication date: February 18, 2021
    Inventors: Lawrence Prestousa Natan, Adrian Arcedera, Roveluz Lledo-Reyes, Sarah Christine-Sanchez Torrefranca
  • Semiconductor package with multiple compartments
    Patent number: 10843918
    Abstract: A semiconductor device may include a first substrate, a first electrical component, a lid, a second substrate, and a second electrical component. The first substrate may include an upper surface, a lower surface, and an upper cavity in the upper surface. The first electrical component may reside in the upper cavity of the first substrate. The lid may cover the upper cavity and may include a port that permits fluid to flow between an environment external to the semiconductor device and the upper cavity. The second substrate may include the second electrical component mounted to an upper surface of the second substrate. The lower surface of the first substrate and the upper surface of the second substrate may fluidically seal the second electrical component from the upper cavity.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: November 24, 2020
    Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
    Inventors: Lawrence Prestousa Natan, Adrian Arcedera, Roveluz Lledo-Reyes, Sarah Christine-Sanchez Torrefranca
  • SEMICONDUCTOR PACKAGE WITH MULTIPLE COMPARTMENTS
    Publication number: 20190276306
    Abstract: A semiconductor device may include a first substrate, a first electrical component, a lid, a second substrate, and a second electrical component. The first substrate may include an upper surface, a lower surface, and an upper cavity in the upper surface. The first electrical component may reside in the upper cavity of the first substrate. The lid may cover the upper cavity and may include a port that permits fluid to flow between an environment external to the semiconductor device and the upper cavity. The second substrate may include the second electrical component mounted to an upper surface of the second substrate. The lower surface of the first substrate and the upper surface of the second substrate may fluidically seal the second electrical component from the upper cavity.
    Type: Application
    Filed: March 4, 2019
    Publication date: September 12, 2019
    Inventors: Lawrence Prestousa Natan, Adrian Arcedera, Roveluz Lledo-Reyes, Sarah Christine-Sanchez Torrefranca
  • Semiconductor package with multiple compartments
    Patent number: 10221064
    Abstract: A semiconductor device may include a first substrate, a first electrical component, a lid, a second substrate, and a second electrical component. The first substrate may include an upper surface, a lower surface, and an upper cavity in the upper surface. The first electrical component may reside in the upper cavity of the first substrate. The lid may cover the upper cavity and may include a port that permits fluid to flow between an environment external to the semiconductor device and the upper cavity. The second substrate may include the second electrical component mounted to an upper surface of the second substrate. The lower surface of the first substrate and the upper surface of the second substrate may fluidically seal the second electrical component from the upper cavity.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: March 5, 2019
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Lawrence Prestousa Natan, Adrian Arcedera, Roveluz Lledo-Reyes, Sarah Christine-Sanchez Torrefranca
  • SEMICONDUCTOR PACKAGE WITH MULTIPLE COMPARTMENTS
    Publication number: 20180251369
    Abstract: A semiconductor device may include a first substrate, a first electrical component, a lid, a second substrate, and a second electrical component. The first substrate may include an upper surface, a lower surface, and an upper cavity in the upper surface. The first electrical component may reside in the upper cavity of the first substrate. The lid may cover the upper cavity and may include a port that permits fluid to flow between an environment external to the semiconductor device and the upper cavity. The second substrate may include the second electrical component mounted to an upper surface of the second substrate. The lower surface of the first substrate and the upper surface of the second substrate may fluidically seal the second electrical component from the upper cavity.
    Type: Application
    Filed: March 23, 2018
    Publication date: September 6, 2018
    Inventors: Lawrence Prestousa Natan, Adrian Arcedera, Roveluz Lledo-Reyes, Sarah Christine-Sanchez Torrefranca
  • Semiconductor package with multiple compartments
    Patent number: 9932221
    Abstract: A semiconductor device may include a first substrate, a first electrical component, a lid, a second substrate, and a second electrical component. The first substrate may include an upper surface, a lower surface, and an upper cavity in the upper surface. The first electrical component may reside in the upper cavity of the first substrate. The lid may cover the upper cavity and may include a port that permits fluid to flow between an environment external to the semiconductor device and the upper cavity. The second substrate may include the second electrical component mounted to an upper surface of the second substrate. The lower surface of the first substrate and the upper surface of the second substrate may fluidically seal the second electrical component from the upper cavity.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: April 3, 2018
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Lawrence Prestousa Natan, Adrian Arcedera, Roveluz Lledo-Reyes, Sarah Christine-Sanchez Torrefranca