Patents by Inventor Rowan Hughes

Rowan Hughes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
    Patent number: 4908242
    Abstract: Electroless metal plating solutions are formulated and controlled to provide high quality metal deposits by establishing the intrinsic cathodic reaction rate of the solution less than 110% of the intrinsic anodic reaction rate. Methods are provided to formulate electroless copper plating solutions which can deposit copper on printed wiring boards of quality sufficient to pass a thermal stress of 10 seconds contact with molten solder at 288.degree. C. without cracking the copper deposits on the surface of the printed wiring boards or in the holes. The ratio of the anodic reaction rate to the cathodic reaction rate can be determined by electrochemical measurements, or it can be estimated by varying the concentration of the reactants and measuring the plating rates.
    Type: Grant
    Filed: April 29, 1988
    Date of Patent: March 13, 1990
    Assignee: Kollmorgen Corporation
    Inventors: Rowan Hughes, Milan Paunovic, Rudolph J. Zeblisky