Patents by Inventor Rowel TABAJONDA

Rowel TABAJONDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGE WITH CONCAVE WETTABILITY AND/OR METALLIZATION LAYER
    Publication number: 20250054842
    Abstract: A package including a component for a package is disclosed. In one example, wherein the component comprises a functional body, and a wettability layer arranged on a main surface of the functional body and configured for promoting wetting of a connection medium to be applied on the wettability layer for connecting the component with a further component of the package. The wettability layer has a lateral circumference at least part of which having a concave edge.
    Type: Application
    Filed: August 1, 2024
    Publication date: February 13, 2025
    Applicant: Infineon Technologies AG
    Inventors: Rowel TABAJONDA, Michael STADLER, Aira Lourdes Baring VILLAMOR, Mei Yih GOH, Juliane JUNESCH, Chee Voon TAN, Mei Qi TAY