Patents by Inventor Roxan Lemire

Roxan Lemire has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11209598
    Abstract: A photonic package is provided. The photonic package includes a base substrate defining an aperture, a top die and a photonic integrated circuit (PIC) die. The top die includes a body with first and second top die sections. The first top die section is connectable with the base substrate. The PIC die includes body with first and second PIC die sections. The PIC die is disposable in the aperture such that the second PIC die section is connectable with the second top die section and the first PIC die section extends beyond the second top die section and is exposed for connection to a waveguide assembly.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: December 28, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Barnim Alexander Janta-Polczynski, Isabel De Sousa, Jean Audet, Maryse Cournoyer, Sylvain Pharand, Roxan Lemire, Louis-Marie Achard, Paul Francis Fortier
  • Publication number: 20200279840
    Abstract: A photonic package is provided. The photonic package includes a base substrate defining an aperture, a top die and a photonic integrated circuit (PIC) die. The top die includes a body with first and second top die sections. The first top die section is connectable with the base substrate. The PIC die includes body with first and second PIC die sections. The PIC die is disposable in the aperture such that the second PIC die section is connectable with the second top die section and the first PIC die section extends beyond the second top die section and is exposed for connection to a waveguide assembly.
    Type: Application
    Filed: February 28, 2019
    Publication date: September 3, 2020
    Inventors: BARNIM ALEXANDER JANTA-POLCZYNSKI, Isabel De Sousa, Jean Audet, Maryse Cournoyer, Sylvain Pharand, Roxan Lemire, Louis-Marie Achard, Paul Francis Fortier
  • Patent number: 10706204
    Abstract: A method of performing automated surface-mount package design includes obtaining physical inputs that include names and locations of top and bottom pins, and obtaining electrical inputs that include electrical parameters such as impedance. The method also includes automatically performing analysis and processing of the physical inputs and the electrical inputs. A design file for manufacture of the surface-mount package is automatically generated based on the performing the analysis and the processing. The design file specifies a number and material of layers of the surface-mount package.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: July 7, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jean Audet, Alain Ayotte, Franklin Baez, Anson Call, Deana Cosmadelis, Jason Lee Frankel, Kevin Grosselfinger, Roxan Lemire, Marek Andrzej Orlowski, Gilles Poitras, Paul Robert Walling
  • Publication number: 20200104454
    Abstract: A method of performing automated surface-mount package design includes obtaining physical inputs that include names and locations of top and bottom pins, and obtaining electrical inputs that include electrical parameters such as impedance. The method also includes automatically performing analysis and processing of the physical inputs and the electrical inputs. A design file for manufacture of the surface-mount package is automatically generated based on the performing the analysis and the processing. The design file specifies a number and material of layers of the surface-mount package.
    Type: Application
    Filed: October 2, 2018
    Publication date: April 2, 2020
    Inventors: Jean Audet, Alain Ayotte, Franklin Baez, Anson Call, Deana Cosmadelis, Jason Lee Frankel, Kevin Grosselfinger, Roxan Lemire, Marek Andrzej Orlowski, Gilles Poitras, Paul Robert Walling