Patents by Inventor Roxanna Bauzon Samson
Roxanna Bauzon Samson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11152324Abstract: A method of making a plurality of integrated circuit (“IC”) packages includes picking up a plurality of physically unconnected IC components; and simultaneously placing each of the physically unconnected IC components on corresponding portions of an unsingulated IC package strip that includes a sheet of integrally connected leadframes.Type: GrantFiled: October 3, 2017Date of Patent: October 19, 2021Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Roxanna Bauzon Samson, Ruby Ann Maya Merto, Lorraine Rivera Duldulao, Jason Binay-an Colte
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Publication number: 20180033758Abstract: A method of making a plurality of integrated circuit (“IC”) packages includes picking up a plurality of physically unconnected IC components; and simultaneously placing each of the physically unconnected IC components on corresponding portions of an unsingulated IC package strip that includes a sheet of integrally connected leadframes.Type: ApplicationFiled: October 3, 2017Publication date: February 1, 2018Inventors: Roxanna Bauzon Samson, Ruby Ann Maya Merto, Lorraine Rivera Duldulao, Jason Binay-an Colte
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Patent number: 9698085Abstract: A method of processing a leadframe strip having opposite first and second longitudinal ends and a plurality of leadframe panels positioned between the first and second longitudinal ends, each of the leadframe panels including an array of leadframe portions. The method includes saw cutting the leadframe rails and panels with a plurality of laterally extending saw cuts that each extend through the first and second rails and a panel connector portion of the leadframe strip positioned between adjacent panels of the leadframe strip. A method of reducing blade heating during leadframe strip singulation is described. Leadframe strip assemblies are also described.Type: GrantFiled: December 22, 2015Date of Patent: July 4, 2017Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Rex Araneta Cari-an, Ruby Ann Merto Camenforte, Roxanna Bauzon Samson, Glenn Juan Morado
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Publication number: 20170179008Abstract: A method of processing a leadframe strip having opposite first and second longitudinal ends and a plurality of leadframe panels positioned between the first and second longitudinal ends, each of the leadframe panels including an array of leadframe portions. The method includes saw cutting the leadframe rails and panels with a plurality of laterally extending saw cuts that each extend through the first and second rails and a panel connector portion of the leadframe strip positioned between adjacent panels of the leadframe strip. A method of reducing blade heating during leadframe strip singulation is described. Leadframe strip assemblies are also described.Type: ApplicationFiled: December 22, 2015Publication date: June 22, 2017Inventors: Rex Araneta Cari-an, Ruby Ann Merto Camenforte, Roxanna Bauzon Samson, Glenn Juan Morado
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Publication number: 20160276185Abstract: A method of making a plurality of integrated circuit (“IC”) packages includes picking up a plurality of physically unconnected IC components; and simultaneously placing each of the physically unconnected IC components on corresponding portions of an unsingulated IC package strip that includes a sheet of integrally connected leadframes.Type: ApplicationFiled: March 17, 2015Publication date: September 22, 2016Inventors: Roxanna Bauzon Samson, Ruby Ann Maya Merto, Lorraine Rivera Duldulao, Jason Binay-an Colte
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Patent number: 9355942Abstract: Gang clips (500) having a flat area (510), a ridge (510a), and tie bars (530b) extending from the flat area, the end portions of the ties bars aligned in a common x-direction; a plurality of gang clips having respective end portions of tie bars merged in x-direction to form an elongated chain (701) of clips; and a plurality of chains arrayed parallel to each other, free of tie bars between adjacent chains, the plurality having the chain ends tied at both ends (730a) to rails (740) normal to the chains to form a matrix (700) of clips having the rails as a stable frame.Type: GrantFiled: May 15, 2014Date of Patent: May 31, 2016Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Roxanna Bauzon Samson, Jeffrey de Guzman Esquejo, Ramices Julian Sanchez, Ramil Alfonso Viluan
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Publication number: 20150371930Abstract: A method of making an IC package having a die and a substrate that are to be attached at an attachment station including providing the die and substrate and, at a location remote from the attachment station, coating at least one of the die and a die attachment portion of the substrate with attachment medium.Type: ApplicationFiled: June 18, 2014Publication date: December 24, 2015Inventors: Ruby Ann Maya Merto, Roxanna Bauzon Samson
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Patent number: 9219052Abstract: A method of making a flip chip assembly includes a substrate having a top surface and forming a plurality of generally longitudinally extending, laterally spaced apart bond fingers are formed on the top surface. Each of the plurality of bond fingers has a first longitudinal end portion and a second longitudinal end portion. Applying a transversely extending solder resist strip over the first longitudinal end portions of the bond fingers. The strip has an edge wall with a plurality of longitudinally projecting tooth portions separated by gaps. Each tooth portion and each gap aligned with a different one of the bond fingers in each adjacent pair of bond fingers.Type: GrantFiled: May 15, 2014Date of Patent: December 22, 2015Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Raymond Maldan Partosa, Jesus Bajo Bautista, James Raymond Baello, Roxanna Bauzon Samson
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Publication number: 20150332989Abstract: Gang clips (500) having a flat area (510), a ridge (510a), and tie bars (530b) extending from the flat area, the end portions of the ties bars aligned in a common x-direction; a plurality of gang clips having respective end portions of tie bars merged in x-direction to form an elongated chain (701) of clips; and a plurality of chains arrayed parallel to each other, free of tie bars between adjacent chains, the plurality having the chain ends tied at both ends (730a) to rails (740) normal to the chains to form a matrix (700) of clips having the rails as a stable frame.Type: ApplicationFiled: May 15, 2014Publication date: November 19, 2015Inventors: Roxanna Bauzon Samson, Jeffrey de Guzman Esquejo, Ramices Julian Sanchez, Ramil Alfonso Viluan
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Publication number: 20140248746Abstract: A method of making a flip chip assembly includes a substrate having a top surface and forming a plurality of generally longitudinally extending, laterally spaced apart bond fingers are formed on the top surface. Each of the plurality of bond fingers has a first longitudinal end portion and a second longitudinal end portion. Applying a transversely extending solder resist strip over the first longitudinal end portions of the bond fingers. The strip has an edge wall with a plurality of longitudinally projecting tooth portions separated by gaps. Each tooth portion and each gap aligned with a different one of the bond fingers in each adjacent pair of bond fingers.Type: ApplicationFiled: May 15, 2014Publication date: September 4, 2014Applicant: Texas Instruments IncorporatedInventors: Raymond Maldan Partosa, Jesus Bajo Bautista, James Raymond Baello, Roxanna Bauzon Samson
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Publication number: 20140197534Abstract: A flip chip mounting board includes a substrate having a top surface and a plurality of generally parallel, longitudinally extending, laterally spaced apart bond fingers are formed on the top surface. Each of the plurality of bond fingers has a first longitudinal end portion and a second longitudinal end portion. A first strip of laterally extending solder resist material overlies the first longitudinal end portions of the bond fingers. The first strip has an edge wall with a plurality of longitudinally projecting tooth portions separated by gaps with a longitudinally extending tooth portion being aligned with every other one of the bond fingers. Adjacent bond fingers have first end portions covered by different longitudinal lengths of solder resist material.Type: ApplicationFiled: January 16, 2013Publication date: July 17, 2014Applicant: Texas Instruments IncorporatedInventors: Raymond Maldan Partosa, Jesus Bajo Bautista, JR., James Raymond Baello, Roxanna Bauzon Samson
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Patent number: 8766461Abstract: A flip chip mounting board includes a substrate having a top surface and a plurality of generally parallel, longitudinally extending, laterally spaced apart bond fingers are formed on the top surface. Each of the plurality of bond fingers has a first longitudinal end portion and a second longitudinal end portion. A first strip of laterally extending solder resist material overlies the first longitudinal end portions of the bond fingers. The first strip has an edge wall with a plurality of longitudinally projecting tooth portions separated by gaps with a longitudinally extending tooth portion being aligned with every other one of the bond fingers. Adjacent bond fingers have first end portions covered by different longitudinal lengths of solder resist material.Type: GrantFiled: January 16, 2013Date of Patent: July 1, 2014Assignee: Texas Instruments IncorporatedInventors: Raymond Partosa, Jesus Bajo Bautista, James Raymond Baello, Roxanna Bauzon Samson