Abstract: A method and an apparatus for increasing the convective heat transfer capabilities of a liquid cooler coupled to various system and vehicle components. The apparatus includes a structure placed within a hollow tubing of the liquid cooler to distort the laminar flow of fluid within a center portion of the hollow tubing, which decreases the temperature rise of the fluid along an outer wall of the hollow tubing associated with laminar flow. In preferred embodiments, the structure has an elongated baffle wire or an extruded elongated ridge member. The structure allows the outer surface of the tubing to have increased cooling at a particular liquid flow rate. As a result, there is an increase in heat transfer capability to a coupled system or vehicle component.

Abstract: A method for increasing the convective heat transfer capabilities of a liquid cooler coupled to various system and vehicle components. A structure is placed within a hollow tubing of the liquid cooler to distort the laminar flow of fluid within a center portion of the hollow tubing, which decreases the temperature rise of the fluid along an outer wall of the hollow tubing associated with laminar flow. In preferred embodiments, the structure consists of an elongated baffle wire or an extruded elongated ridge member. The structure allows the outer surface of the tubing to have increased cooling at a particular liquid flow rate, which allows more heat transfer capability to a coupled system or vehicle component as compared with liquid coolers without the structure.

Abstract: A liquid-cooled heat-sink including a cooling housing defining a cooling chamber where the chamber is positioned adjacent to a semi-conductor device or devices to be cooled. An inlet port introduces a liquid coolant into the chamber and an exit port removes the liquid coolant from the chamber. A single unit plastic baffle is positioned within the chamber. The baffle includes strategically configured plenums, jet ports and transfer ports that direct the liquid coolant in both a series and parallel manner for increased cooling efficiency. The jet ports direct the liquid coolant onto the semiconductor devices in a parallel manner, and liquid coolant is transferred from one set of jets to another set of jets in a series manner.