Abstract: A method of creating a multi-layered monolithic circuit structure wherein individual layers of standard alumina thick film ceramic substrate and the resistors, inductors, capacitors, and other circuit componentry printed thereon are fired, and the circuit componentry trimmed or otherwise adjusted to achieve a desired degree of precision prior to combining the layers with a thick film glass bonding agent to form the monolithic structure.

Abstract: A microsystem enclosure for hermetically sealing and thereby protecting a microsystem located on a substrate from the potentially damaging effects of exposure to moisture, dust, and other external environmental or operating conditions. The enclosure broadly comprises a single-piece hermetic cover structure and a single solder preform. The preform facilitates sealing the cover to the substrate in high-temperature, single-step process so as to create a hermetic cavity wherein the microsystem resides.

Abstract: A microsystem enclosure for hermetically sealing and thereby protecting a microsystem located on a substrate from the potentially damaging effects of exposure to moisture, dust, and other external environmental or operating conditions. The enclosure broadly comprises a single-piece hermetic cover structure and a single solder preform. The preform facilitates sealing the cover to the substrate in high-temperature, single-step process so as to create a hermetic cavity wherein the microsystem resides.