Abstract: A method for modifying a quality of a fruit includes cutting a live stem attached to a live fruit at a cut distance from the fruit, producing a cut end of the stem, contacting only the cut end of the stem with a solution comprising at least one mobile and quality-modifying food ingredient while protecting the fruit from contact with the solution, and keeping the cut end of the stem in contact with the solution for an incubation time sufficient to allow absorption and transport of the food ingredient into the fruit, the food ingredient conferring a modified quality upon the fruit. A system for practicing the method and an edible raw plant product produced by the method are also disclosed.

Abstract: A method for modifying a quality of a fruit includes cutting a live stem attached to a live fruit at a cut distance from the fruit, producing a cut end of the stem, contacting only the cut end of the stem with a solution comprising at least one mobile and quality-modifying food ingredient while protecting the fruit from contact with the solution, and keeping the cut end of the stem in contact with the solution for an incubation time sufficient to allow absorption and transport of the food ingredient into the fruit, the food ingredient conferring a modified quality upon the fruit. A system for practicing the method and an edible raw plant product produced by the method are also disclosed.

Abstract: A method for modifying a quality of a fruit includes cutting a live stem attached to a live fruit at a cut distance from the fruit, producing a cut end of the stem, contacting only the cut end of the stem with a solution comprising at least one mobile and quality-modifying food ingredient while protecting the fruit from contact with the solution, and keeping the cut end of the stem in contact with the solution for an incubation time sufficient to allow absorption and transport of the food ingredient into the fruit, the food ingredient conferring a modified quality upon the fruit. A system for practicing the method and an edible raw plant product produced by the method are also disclosed.

Abstract: Semiconductor packages and methods of making packages are disclosed. An exemplary method includes providing a printed circuit board having a first surface with circuit traces thereon, first apertures, and a second aperture. Each circuit trace overlies a first aperture, and an end of the circuit trace is near the second aperture. Solder balls are placed in each first aperture and fused to the overlying circuit trace. A die is placed in the second aperture. Each circuit trace may include a third aperture over the first aperture. Solder from the solder ball within the first aperture fills the overlying third aperture. A second package can be stacked on a first package. Solder balls of the second package each fuse with an underlying solder ball of the first package through a third aperture of the first package. The dies of the stacked packages may be positioned for optical communication with each other.

Abstract: A plurality of integrated circuit chip (IC chip) packages are fabricated simultaneously from a single insulating substrate having sections. In each section, an IC chip is attached. Bonding pads on the IC chip are electrically connected to first metallizations on a substrate first surface. The first metallizations, IC chip including bonding pads and first substrate surface are then encapsulated. Interconnection balls or pads are formed at substrate bonding locations on a substrate second surface, the interconnection pads or balls being electrically connected to corresponding first metallizations. The substrate and encapsulant are then cut along the periphery of each section to form the plurality of IC chip packages.

Abstract: Disclosed herein are semiconductor packages and stacks thereof. An example package includes an insulative substrate having a first surface, first apertures, a second aperture, and circuit traces on the first surface. A first portion of each circuit trace overlies a first aperture and an end of the circuit trace is near the second aperture. A solder ball is in each first aperture, fused to the overlying circuit trace. A semiconductor die is in the second aperture and is electrically connected to the ends of the traces. A third aperture may extend through the first portion of each circuit trace. A second package can be stacked on a first package. Solder balls of the second package each fuse with an underlying solder ball of the first package through a third aperture of the first package. The dies of the stacked packages may be positioned for optical communication with each other.

Abstract: A heat spreader with one or more integrally formed open regions discourages the formation of air bubbles in the encapsulant of a plastic packaged integrated circuit. Little or no air bubbles can be trapped between the heat spreader and the encapsulant surface. Any air bubbles that do form in the encapsulant can escape through the open regions of the heat spreader. The heat spreader of the invention is placed on the surface of a liquid encapsulant and the encapsulant fills the open regions of the heat spreader and covers the sides of the open regions. When the encapsulant hardens, a form fitting bond between the heat spreader and the upper surface of the encapsulant is created. This form fitting bond provides for secure attachment of the heat spreader to the surface of the encapsulant. One embodiment of the heat spreader of the invention includes integrally formed tabs with which a supplementary heat spreader, such as heat tower, is inserted for even greater heat dissipation capability.