Patents by Inventor Roy D. Nye

Roy D. Nye has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10182515
    Abstract: In one aspect, conduction cooled modules are described herein. In some implementations, a conduction cooled module comprises first and second external support structures arranged in facing opposition to one another, forming a component envelope therebetween. In some implementations, the modules are configured to contact at least one cold plate and to retain at least one printed wiring board in the component envelope in between the first external support structure and the second external support structure.
    Type: Grant
    Filed: May 2, 2014
    Date of Patent: January 15, 2019
    Assignee: THE BOEING COMPANY
    Inventors: Charles E. Kusuda, Jeffrey W. Glasnovich, Erik L. Godo, Roy D. Nye, Namsoo P. Kim
  • Publication number: 20150319881
    Abstract: In one aspect, conduction cooled modules are described herein. In some implementations, a conduction cooled module comprises first and second external support structures arranged in facing opposition to one another, forming a component envelope therebetween. In some implementations, the modules are configured to contact at least one cold plate and to retain at least one printed wiring board in the component envelope in between the first external support structure and the second external support structure.
    Type: Application
    Filed: May 2, 2014
    Publication date: November 5, 2015
    Inventors: Charles E. Kusuda, Jeffrey W. Glasnovich, Erik L. Godo, Roy D. Nye, Namsoo P. Kim