Patents by Inventor Roy D. Shepard

Roy D. Shepard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11974916
    Abstract: Various aspects of the present disclosure are directed toward apparatuses, systems, and methods that include a prosthetic valve. The prosthetic valve may include a jacket configured to cover at least one of gaps, spaces, or interfaces in a frame or between one or more leaflets attached to the frame.
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: May 7, 2024
    Assignee: Edwards Lifesciences Corporation
    Inventors: David J. Arcaro, Kyle W. Colavito, Dustin V. Dienno, Cody L. Hartman, Roy Manygoats, Jr., Ryan S. Titone, Ryan D. Smith, Joshua A. Sprinkle, Benjamin A. Smith, James L. Goepfrich, Michael J. Shepard
  • Patent number: 5538175
    Abstract: In a wave solder manufacturing process, a test device is used to measure the contact-area between a solder wave and a printed wiring board. In particular, the test device is a printed wiring board (PWB) that includes at least two arrays of electrical contacts, one array near each side of the PWB. As the PWB makes contact with a solder wave, the number of electrical contacts in each array that are grounded by the solder wave are counted and displayed on an alpha-numeric display mounted on top of the PWB. This "distance-based" measurement provides an accurate determination of the uniformity of the contact-area, and concomitantly the dwell-time of the soldering process. This test device provides a basis for real-time adjustment of solder wave height, and end-to-end balance, in a solder wave machine. In particular a wave solder machine includes a means for receiving contact-area information from the test device and a means for adjusting the solder wave in response to the contact-area information.
    Type: Grant
    Filed: November 21, 1994
    Date of Patent: July 23, 1996
    Assignee: AT&T Corp.
    Inventors: Anthony L. Massini, Jr., Roy D. Shepard
  • Patent number: 5533663
    Abstract: In a wave solder manufacturing process, a test device is used to measure the contact-area between a solder wave and a printed wiring board. In particular, the test device is a printed wiring board (PWB) that includes at least two arrays of electrical contacts, one array near each side of the PWB. As the PWB makes contact with a solder wave, the number of electrical contacts in each array that are grounded by the solder wave are counted and displayed on an alpha-numeric display mounted on top of the PWB. This "distance-based" measurement provides an accurate determination of the uniformity of the contact-area, and concomitantly the dwell-time of the soldering process.
    Type: Grant
    Filed: November 21, 1994
    Date of Patent: July 9, 1996
    Assignee: AT&T Corp.
    Inventors: Anthony L. Massini, Jr., Roy D. Shepard