Patents by Inventor Roy De Wit

Roy De Wit has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12759799
    Abstract: A modular insulating system for establishing a thermally insulated connection between a first environment and a second environment and a casing segment for use in the modular insulating system are disclosed. The first environment and second environment are mutually separated by an intermediate environment, in particular the open air. The modular insulating system is configured for enabling insulated transport of a product from the first environment to the second environment in particular through the intermediate environment.
    Type: Grant
    Filed: February 20, 2023
    Date of Patent: October 13, 2026
    Assignee: TPI-POLYTECHNIEK B.V.
    Inventors: Roy De Wit, Peter Willi Gerrit Markert
  • Publication number: 20250153951
    Abstract: The invention relates to a modular insulating system for establishing a thermally insulated connection between a first environment and a second environment, said first environment and second environment being mutually separated by an intermediate environment, in particular the open air, the modular insulating system being configured for enabling insulated transport of a product from the first environment to the second environment in particular through the intermediate environment. The invention further relates to a casing segment for use in a modular insulating system according to the invention.
    Type: Application
    Filed: February 20, 2023
    Publication date: May 15, 2025
    Inventors: Roy De Wit, Peter, Willi, Gerrit Markert