Abstract: A three-dimensional array of memory elements is formed across multiple layers of planes positioned at different distances above a semiconductor substrate. The memory elements reversibly change a level of electrical conductance in response to a voltage difference being applied across them. The three-dimensional array includes a two-dimensional array of pillar lines from the substrate through the multiple layers of planes. A first set of pillar lines acts as local bit lines for accessing the memory elements together with an array of word lines on each plane. A second set of pillar lines is connected to the word lines. An array of metal lines on the substrate is switchable connected to the pillar lines to provide access to the first and second sets of pillar lines, thereby to provide access respectively to the bit lines and word lines of the three-dimensional array.

Abstract: A three-dimensional array of memory elements is formed across multiple layers of planes positioned at different distances above a semiconductor substrate. The memory elements are each accessible by a word line in a plane and a local bit line. The three-dimensional array includes a two-dimensional array of pillar lines through the multiple layers of planes. The pillar lines are of a first type that act as local bit lines and a second type that provide access to the word lines by having respective memory elements preset to a permanently low resistance state for connecting second-type pillar lines for exclusive access to respective word lines. An array of metal lines on the substrate is switchably connected to the vertical bit lines to provide access to the local bit lines and the word lines.

Abstract: A three-dimensional array of memory elements is formed across multiple layers of planes positioned at different distances above a semiconductor substrate. The memory elements reversibly change a level of electrical conductance in response to a voltage difference being applied across them. The three-dimensional array includes a two-dimensional array of pillar lines from the substrate through the multiple layers of planes. A first set of pillar lines acts as local bit lines for accessing the memory elements together with an array of word lines on each plane. A second set of pillar lines is connected to the word lines. An array of metal lines on the substrate is switchable connected to the pillar lines to provide access to the first and second sets of pillar lines, thereby to provide access respectively to the bit lines and word lines of the three-dimensional array.

Abstract: A three-dimensional array of memory elements is formed across multiple layers of planes positioned at different distances above a semiconductor substrate. The memory elements reversibly change a level of electrical conductance in response to a voltage difference being applied across them. The three-dimensional array includes a two-dimensional array of pillar lines from the substrate through the multiple layers of planes. A first set of pillar lines acts as local bit lines for accessing the memory elements together with an array of word lines on each plane. A second set of pillar lines is connected to the word lines. An array of metal lines on the substrate is switchable connected to the pillar lines to provide access to the first and second sets of pillar lines, thereby to provide access respectively to the bit lines and word lines of the three-dimensional array.

Abstract: A three-dimensional array of memory elements is formed across multiple layers of planes positioned at different distances above a semiconductor substrate. The memory elements reversibly change a level of electrical conductance in response to a voltage difference being applied across them. The three-dimensional array includes a two-dimensional array of pillar lines from the substrate through the multiple layers of planes. A first set of pillar lines acts as local bit lines for accessing the memory elements together with an array of word lines on each plane. A second set of pillar lines is connected to the word lines. An array of metal lines on the substrate is switchable connected to the pillar lines to provide access to the first and second sets of pillar lines, thereby to provide access respectively to the bit lines and word lines of the three-dimensional array.

Abstract: A magnetic random access memory circuit comprises a plurality of magnetic memory cells, each of the memory cells including a magnetic storage element having an easy axis and a hard axis associated therewith, and a plurality of column lines and row lines for selectively accessing one or more of the memory cells, each of the memory cells being proximate to an intersection of one of the column lines and one of the row lines. Each of the magnetic memory cells is arranged such that the easy axis is substantially parallel to a direction of flow of a sense current and the hard axis is substantially parallel to a direction of flow of a write current.

Abstract: A magnetic random access memory circuit comprises a plurality of magnetic memory cells, each of the memory cells including a magnetic storage element having an easy axis and a hard axis associated therewith, and a plurality of column lines and row lines for selectively accessing one or more of the memory cells, each of the memory cells being proximate to an intersection of one of the column lines and one of the row lines. Each of the magnetic memory cells is arranged such that the easy axis is substantially parallel to a direction of flow of a sense current and the hard axis is substantially parallel to a direction of flow of a write current.

Abstract: A magnetic random access memory circuit comprises a plurality of magnetic memory cells, each of the memory cells including a magnetic storage element having an easy axis and a hard axis associated therewith, and a plurality of column lines and row lines for selectively accessing one or more of the memory cells, each of the memory cells being proximate to an intersection of one of the column lines and one of the row lines. Each of the magnetic memory cells is arranged such that the easy axis is substantially parallel to a direction of flow of a sense current and the hard axis is substantially parallel to a direction of flow of a write current.

Abstract: A magnetic memory circuit comprises a plurality of memory cells and a plurality of bit lines coupled to the memory cells for selectively accessing one or more of the memory cells. The memory circuit comprises at least one bit line programming circuit, configurable as a current source for generating a programming current for writing a logical state of at least one memory cell and/or a current sink for returning the programming current, and a first set of switches. The first set of switches are disabled at least during a read operation of the memory cells and at least a portion of the first set of switches are selectively enabled during a write operation of the memory cells. Each switch in the first set of switches is configured to selectively couple the at least one bit line programming circuit to a corresponding one of the bit lines in response to a first control signal. The memory circuit further comprises at least one sense amplifier and a second set of switches.

Abstract: A magnetic memory circuit comprises a plurality of memory cells and a plurality of bit lines coupled to the memory cells for selectively accessing one or more of the memory cells. The memory circuit comprises at least one bit line programming circuit, configurable as a current source for generating a programming current for writing a logical state of at least one memory cell and/or a current sink for returning the programming current, and a first set of switches. The first set of switches are disabled at least during a read operation of the memory cells and at least a portion of the first set of switches are selectively enabled during a write operation of the memory cells. Each switch in the first set of switches is configured to selectively couple the at least one bit line programming circuit to a corresponding one of the bit lines in response to a first control signal. The memory circuit further comprises at least one sense amplifier and a second set of switches.

Abstract: A magneto-resistive memory cell and a method of forming the memory cell, includes a substrate, a single crystalline semiconductor diode formed in the substrate; and a first thin film conductor recessed in the substrate, and a second thin film conductor formed above a magnetic tunnel junction formed on the diode. The diode and the first thin film conductor share a non-planar common surface, such that the metal tunnel junction is a predetermined distance from the thin film conductor.

Abstract: A non-volatile memory array having a substrate, a first plurality of electrically conductive traces formed on the substrate, a second plurality of electrically conductive traces formed on the substrate and overlapping first plurality of traces at a plurality of intersection regions, and a plurality of memory cells. Each memory cell is located at an intersection region between one of the first plurality of traces and one of the second plurality of traces. At least one memory cell includes a non-linear magnetic tunnel junction storage element. The non-linear magnetic tunnel junction storage element has at least a first ferromagnetic layer, a barrier layer and a second ferromagnetic layer. The non-linear magnetic tunnel junction storage element has a non-linearity that is defined by a current having a first magnitude flowing through the non-linear magnetic tunnel junction storage element for a bias across the non-linear magnetic tunnel junction storage element of about 0.

Abstract: A disk controller system includes a microprocessor, a hard disk controller, a disk channel path, a host communications path, and an interface coupled to each of the microprocessor, hard disk controller, disk channel path and host communications path. A unified non-volatile memory is coupled to the interface that has a plurality of memory spaces. A memory space is allocated for each of the microprocessor, hard disk controller, disk channel path and host communications path. Each memory space is separated from another memory space by a programmable memory space boundary. The microprocessor, hard disk controller and the unified memory are all fabricated on a single substrate.

Abstract: A field compensation circuit for selectively writing one or more selected magnetic memory cells in a magnetic random access memory (MRAM) includes a controller for detecting a characteristic representative of an anticipated interaction between a magnetic field emanating from a bit line corresponding to a selected memory cell and at least one stray magnetic field emanating from one or more bit lines associated with one or more memory cells in close relative proximity to the selected memory cell. A control signal generated by the controller is indicative of the detected characteristic. The field compensation circuit further includes a programmable current source operatively coupled to the bit line corresponding to the selected memory cell, the programmable current source including an input for receiving the control signal. The programmable current source generates a write current having a magnitude which varies in response to the control signal.

Abstract: A semiconductor device such as a P-N or P-I-N junction diode, includes a first semiconductor layer having a first conductivity-type and being mounted over a metal address line, and a second semiconductor layer having a second conductivity-type and being mounted over the first semiconductor material. The diode preferably has a thickness of substantially no more than about 1 micron, and the diode includes a P-N junction confined to a thickness of less than about 0.1 micron. In the preferred embodiment the method comprises depositing a first semiconductor layer having a first conductivity type, depositing a second intrinsic layer, annealing to convert both layers to a polycrystalline layer, implanting ions of a second conductivity type into the second layer, and annealing to convert the second layer to a polycrystalline. The result is a diode having an ultra-sharp p-n junction.

Abstract: An architecture for selectively writing one or more magnetic memory cells in a magnetic random access memory (MRAM) device comprises at least one write line including a global write line conductor and a plurality of segmented write line conductors connected thereto, the global write line conductor being substantially isolated from the memory cells.

Abstract: A non-volatile memory array includes first and second pluralities of electrically conductive traces formed on a substrate. The second plurality of electrically conductive traces overlap first plurality of traces at a plurality of intersection regions. Each of a plurality of memory cells is located at an intersection region between one of the first plurality of traces and one of the second plurality of traces. At least one of the memory cells includes a non-linear selection element in series with a magnetic tunnel junction storage element. The non-linear selection element includes at least a first metallic electrode layer, a barrier layer and a second metallic electrode layer metal.

Abstract: A magneto-resistive memory cell and a method of forming the memory cell, includes a substrate, a single crystalline semiconductor diode formed in the substrate; and a first thin film conductor recessed in the substrate, and a second thin film conductor formed above a magnetic tunnel junction formed on the diode. The diode and the first thin film conductor share a non-planar common surface, such that the metal tunnel junction is a predetermined distance from the thin film conductor.

Abstract: An interconnection network for connecting memory cells to sense amplifiers in a memory device includes a plurality of sub-arrays having memory cells, a plurality of switch units each of which is associated with a corresponding one of the plurality of sub-arrays, and true and complement input lines of the sense amplifiers each of which receives data from a selected memory cell via an input line and reference from reference cells via the other input line. The reference, which is a mid-level of data in the memory cells, is obtained from a reference cell having the mid-level value. Alternatively, a mid-level reference may be obtained by averaging data of logic values “1” and “0” stored in different reference cells. The reference cells may be disposed in the sub-arrays or outside the sub-arrays. The interconnection network of the present invention has symmetric configuration so that networks of the input lines of the sense amplifiers have substantially equal structure.

Abstract: A non-volatile memory array includes a plurality of memory cells. Each memory cell includes a magnetic tunnel junction device having a first free ferromagnetic layer, a second free ferromagnetic layer and a highly conductive layer. The first ferromagnetic layer of each magnetic tunnel junction device extends in a direction that is substantially parallel to the second ferromagnetic layer of the magnetic tunnel junction device. The highly conductive layer of each magnetic tunnel junction device is formed between the first ferromagnetic layer and the second ferromagnetic layer of the magnetic tunnel junction device. A write current through each selected memory cell flows into the highly conductive layer and along at least a portion of the highly conductive layer. A self-field associated with the write current changes a first predetermined magnetization of the first and second ferromagnetic layers to a second predetermined magnetization.