Abstract: A high voltage arc-resistant laminate for printed circuit boards comprising a substrate and metallic foil bonded on one or both surfaces of the substrate. The substrate includes core sheets of cellulosic paper impregnated with a resin formulation comprising an admixture of resin solids including a major amount of phenolic resins, and minor amount of curing agents for the resins, and face sheets of glass fiber cloth impregnated with a resin formulation consisting substantially entirely of brominated aromatic epoxy resin solids, and minor amount of dicyandiamide curing agent and amine catalyst along with, antimony oxide, thixotropic agent, and pigments. Also disclosed is a process for manufacturing the laminate. A high temperature resistant embodiment is also disclosed in which the core sheet resin is brominated aromatic epoxy instead of phenolic resin.