Abstract: A method of making and the resulting non-metallic CMP conditioning pad comprising a non-metallic substrate and a single layer of abrasive particles bonded to the substrate by a non-metallic bonding medium. Preferred substrates include aluminum oxide and graphite. A bonding system employing finely powdered aluminum oxide particles mixed with a suitable adhesive is employed to bond the abrasive layer to the aluminum oxide substrate. Silicon carbide particles mixed into a compatible adhesive carrier including a polymer composition is preferred for bonding the abrasive particle layer to a graphite or carbide substrate.

Abstract: A conditioning element for trueing and dressing a polishing pad used in a chemical mechanical polishing process (CMP) in connection with the manufacture of semi-conductors is provided with a relatively thin protective coating comprising a material resistant to corrosive attack by CMP slurry compositions, including those particularly well-suited to resist the harsher highly acidic slurry compositions. The CMP conditioning disk comprises a substrate having a surface carrying a monolayer of superabrasive particles braze bonded to the disk and a relatively thin liquid impermeable protective coating which is applied over the surface of the braze bond material and abrasive particles.

Abstract: A conditioning element for trueing and dressing a polishing pad used in a chemical mechanical polishing process (CMP) in connection with the manufacture of semi-conductors is provided with a relatively thin protective coating comprising a material resistant to corrosive attack by CMP slurry compositions, including those particularly well-suited to resist the harsher highly acidic slurry compositions. The CMP conditioning disk comprises a substrate having a surface carrying a monolayer of superabrasive particles braze bonded to the disk and a relatively thin liquid impermeable protective coating which is applied over the surface of the braze bond material and abrasive particles.

Abstract: An improved method of making a monolayer abrasive tool using a relatively low melting point, soft filler metal alloy braze which possesses sufficiently high yield strength combined with a relatively high ductility and low elastic modulus to produce an exceptional bond between a monolayer of superabrasive particles and the tool substrate. The steps of the brazing process include applying a layer of the filler metal alloy including a an active metal in either pre-alloyed or as a mixture with the metal alloy and a monolayer of superabrasive crystals over the filler metal layer. This assembly is heated in a mon-oxidizing atmosphere such as a vacuum to melt the alloy and braze bond the superabrasive particles to the tool substrate. The alloy bond formed possess the properties of a ductility of at least 20 percent elongation, an elastic modulus of less than 15.times.10.sup.6 or less, and a yield strength preferably at least about 45,000 to 50,000 psi.

Abstract: A process for curing and densifying a sol-gel derived inorganic thin film at lower temperatures (between 10.degree. C. and 400.degree. C.) by applying the films to a substrate, drying the film at a low temperature, exposing the film to a low pressure plasma. The film may be an oxide (e.g. SiO.sub.2), nitride (e.g. Si.sub.3 N.sub.4), oxynitride (e.g. SiO.sub.x N.sub.y) or sulfide (e.g. GeS.sub.2).

Abstract: The invention provides a method of coating a surface 21 of a substrate 20, or of an article, of a material, such as glass, metal, ceramic, cloth or the like, with a colored film-like polymeric coating 22 consisting essentially of a plasma formed polymer matrix 23 containing therein particulates 24. The method comprises introducing plasma-polymerizable material through at least one conduit 30 into the interior region 14 of an appropriate apparatus 10, 35, or 39 in which region 14 there is maintained an electrical discharge conducive to plasma polymerize the introduced material and deposit it on surface 21 concurrently with a depositing therewith of the particulates 24, or color centers, of a size and in a distribution adapted through selective scattering and adsorption of light to provide a desired color while the substrate 20 contacts, or is, a cathode element 19 maintained at an electrical potential conducive for the depositing.

Abstract: The adhesion of sputtered chromium or chromium metal alloys to urethane substrates is improved by the application of plasma polymerized acetonitrile coating layers directly beneath and over the chromium layer.