Patents by Inventor Roy Gee Leong Woo

Roy Gee Leong Woo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7082487
    Abstract: CMC boards have standardized dimensions for an “I/O envelope” (to accommodate components for I/O functions) and a “component envelope” (to accommodate components for core board functions). Daughter cards are developed (mainly to perform I/O functions but also to perform core board functions, if desired) that fit within the standardized dimensions of the I/O envelope.
    Type: Grant
    Filed: February 20, 2002
    Date of Patent: July 25, 2006
    Assignee: Spectrum Signal Processing, Inc.
    Inventors: Mohammad Darwish, Leonard G. Pucker, Phillip D. Smith, Roy Gee Leong Woo
  • Publication number: 20030158989
    Abstract: CMC boards have standardized dimensions for an “I/O envelope” (to accommodate components for I/O functions) and a “component envelope” (to accommodate components for core board functions). Daughter cards are developed (mainly to perform I/O functions but also to perform core board functions, if desired) that fit within the standardized dimensions of the I/O envelope.
    Type: Application
    Filed: February 20, 2002
    Publication date: August 21, 2003
    Inventors: Mohammad Darwish, Leonard G. Pucker, Phillip D. Smith, Roy Gee Leong Woo