Abstract: A bonding method includes vacuum bagging a second metal plate atop a first metal plate, with a thermosetting adhesive in a lap joint therebetween covered in turn by a porous peel ply and a porous breather ply; the plates being initially clamped together by applying vacuum through the breather ply; and thermally curing the adhesive, with the breather and peel plies being preselected to capture adhesive seepage from the lap joint and removed with the plies to correspondingly reduce cured adhesive flash.

Abstract: A bonding method includes vacuum bagging a second metal plate atop a first metal plate, with a thermosetting adhesive in a lap joint therebetween covered in turn by a porous peel ply and a porous breather ply; the plates being initially clamped together by applying vacuum through the breather ply; and thermally curing the adhesive, with the breather and peel plies being preselected to capture adhesive seepage from the lap joint and removed with the plies to correspondingly reduce cured adhesive flash.

Abstract: A multi-layered, unbalanced, bonded sandwich panel having improved top load support capability per unit of weight is disclosed. The panel has a core, to the upper surface of which is affixed a multiple-ply top laminate. Similarly affixed to the lower surface of the core is a multiple-ply bottom laminate. The top laminate is thicker than the bottom laminate and supplies increased compressive resistance, while the bottom layer has an enhanced ability to withstand tensile forces. The core is preferably a honeycomb core, and unidirectional, fiberglass epoxy prepreg lamina are favored for each ply.