Abstract: An electronic equipment enclosure comprising a frame, the frame defining a top, a bottom, two sides, a front, and a rear thereof; a rack mounted within the frame, the rack defining a rack volume therewithin; and a panel assembly mounted on the frame, the panel assembly including a top panel, a bottom panel, at least one side panel, and at least one opening door. The enclosure can include a utility space configured to receive a power unit therein. The utility space can be defined by the frame between the panel assembly and the rack volume such that the power unit does not extend beyond the panel assembly or into the rack volume. Both sides, the top, and the bottom of the frame can include mounts configured to allow the enclosure to be mounted or supported.

Abstract: An electronic equipment enclosure comprising a frame, the frame defining a top, a bottom, two sides, a front, and a rear thereof; a rack mounted within the frame, the rack defining a rack volume therewithin; and a panel assembly mounted on the frame, the panel assembly including a top panel, a bottom panel, at least one side panel, and at least one opening door. The enclosure can include a utility space configured to receive a power unit therein. The utility space can be defined by the frame between the panel assembly and the rack volume such that the power unit does not extend beyond the panel assembly or into the rack volume. Both sides, the top, and the bottom of the frame can include mounts configured to allow the enclosure to be mounted or supported.

Abstract: The present disclosure is directed to a server rack assembly, per an embodiment. The server rack includes a housing and a coolant distribution unit. The housing includes a front space region, a rear space region, a plurality of side walls, and at least one rack for supporting heat-generating electronic devices. The coolant distribution unit is located within the rear space region of the housing, proximate to at least one of the plurality of side walls.

Abstract: A thermal buffering module is used in a combined equipment and cooling unit including a housing defining an interior configured to receive electronic equipment, with the electronic equipment being supported by the housing. The combined equipment and cooling unit further includes a cooling unit supported by the housing. The thermal buffering module includes at least one heat exchanger. The thermal buffering module is configured to selectively receive chilled air from the cooling unit to cool the at least one heat exchanger and to selectively receive warm IT air from the electronic equipment to cool the warm IT air as it travels over the at least one heat exchanger.

Abstract: An electronic equipment enclosure comprising a frame, the frame defining a top, a bottom, two sides, a front, and a rear thereof; a rack mounted within the frame, the rack defining a rack volume therewithin; and a panel assembly mounted on the frame, the panel assembly including a top panel, a bottom panel, at least one side panel, and at least one opening door. The enclosure can include a utility space configured to receive a power unit therein. The utility space can be defined by the frame between the panel assembly and the rack volume such that the power unit does not extend beyond the panel assembly or into the rack volume. Both sides, the top, and the bottom of the frame can include mounts configured to allow the enclosure to be mounted or supported.

Abstract: A thermal buffering module is used in a combined equipment and cooling unit including a housing defining an interior configured to receive electronic equipment, with the electronic equipment being supported by the housing. The combined equipment and cooling unit further includes a cooling unit supported by the housing. The thermal buffering module includes at least one heat exchanger. The thermal buffering module is configured to selectively receive chilled air from the cooling unit to cool the at least one heat exchanger and to selectively receive warm IT air from the electronic equipment to cool the warm IT air as it travels over the at least one heat exchanger.

Abstract: A thermal buffering module is used in a combined equipment and cooling unit including a housing defining an interior configured to receive electronic equipment, with the electronic equipment being supported by the housing. The combined equipment and cooling unit further includes a cooling unit supported by the housing. The thermal buffering module includes at least one heat exchanger. The thermal buffering module is configured to selectively receive chilled air from the cooling unit to cool the at least one heat exchanger and to selectively receive warm IT air from the electronic equipment to cool the warm IT air as it travels over the at least one heat exchanger.

Abstract: A condensate collection system for use in HVAC equipment configured to remove condensate from a coil assembly before unintentional release into the surrounding environment and increase energy efficiency by preventing substantial air mixing within the air conditioner itself. The condensate collection system comprising, a tray configured to collect condensate and a lid configured to both prevent the mixing of air and collect condensate, operatively connected by a plurality of standoffs attached to the base of the tray and the bottom of the lid wherein the lid is supported by the tray and the plurality of standoffs. The system further may include one or more condensate drain channels configured to collect and drain condensate from the top of the lid into the tray and subsequently drain from the tray through an exit port.

Abstract: A water collection system is provided for an indirect evaporative cooler. The water collection system includes a housing having an open bottom, a front wall, a back wall, and two end walls, which together define an interior region of the housing. The water collection system further includes a plurality of tube assemblies each extending through one of the front wall and the back wall of the housing and disposed within the interior region of the housing. The water collection system further includes a plurality of panel assemblies disposed within the interior region of the housing above the plurality of tube assemblies. Each panel assembly is associated with a respective tube assembly to channel fluid to the tube assembly. A method of collecting and distributing water within an indirect evaporative cooler configured to spray water on a heat exchanger is further disclosed.

Abstract: A heat exchanger core assembly includes a frame assembly and a plurality of core bundles positioned within the frame assembly. Each core bundle includes at least one row of tubing defining at least one end of the core bundle, an edge seal gasket to seal the core bundle from an adjacently placed core bundle, and an indoor face seal gasket to seal the end with respect to the frame assembly. A method of replacing a core bundle of a heat exchanger core assembly includes identifying a core bundle requiring replacement, removing the core bundle by accessing the core bundle and sliding the core bundle with respect to the remaining plurality of core bundles from the frame assembly, and inserting a replacement core bundle in a space defined by the removed core bundle.

Abstract: A method for constructing a module of a modular cooling unit includes acquiring a plurality of tubes, each tube having a first end and a second end, and overmolding a first header onto the first ends of the plurality of tubes to form a watertight connection between the first header and the first ends of the plurality of tubes, the first header having a plurality of parallel first slots, each slot of the parallel first slots having an extended surface configured to receive and retain the first end of the tube.

Abstract: A water collection system is provided for an indirect evaporative cooler. The water collection system includes a housing having an open bottom, a front wall, a back wall, and two end walls, which together define an interior region of the housing. The water collection system further includes a plurality of tube assemblies each extending through one of the front wall and the back wall of the housing and disposed within the interior region of the housing. The water collection system further includes a plurality of panel assemblies disposed within the interior region of the housing above the plurality of tube assemblies. Each panel assembly is associated with a respective tube assembly to channel fluid to the tube assembly. A method of collecting and distributing water within an indirect evaporative cooler configured to spray water on a heat exchanger is further disclosed.

Abstract: A heat exchanger core assembly includes a frame assembly and a plurality of core bundles positioned within the frame assembly. Each core bundle includes at least one row of tubing defining at least one end of the core bundle, an edge seal gasket to seal the core bundle from an adjacently placed core bundle, and an indoor face seal gasket to seal the end with respect to the frame assembly. A method of replacing a core bundle of a heat exchanger core assembly includes identifying a core bundle requiring replacement, removing the core bundle by accessing the core bundle and sliding the core bundle with respect to the remaining plurality of core bundles from the frame assembly, and inserting a replacement core bundle in a space defined by the removed core bundle.

Abstract: A water collection system is provided for an indirect evaporative cooler. The water collection system includes a housing having an open bottom, a front wall, a back wall, and two end walls, which together define an interior region of the housing. The water collection system further includes a plurality of tube assemblies each extending through one of the front wall and the back wall of the housing and disposed within the interior region of the housing. The water collection system further includes a plurality of panel assemblies disposed within the interior region of the housing above the plurality of tube assemblies. Each panel assembly is associated with a respective tube assembly to channel fluid to the tube assembly. A method of collecting and distributing water within an indirect evaporative cooler configured to spray water on a heat exchanger is further disclosed.

Abstract: A condensate collection system for use in HVAC equipment configured to remove condensate from a coil assembly before unintentional release into the surrounding environment and increase energy efficiency by preventing substantial air mixing within the air conditioner itself. The condensate collection system comprising, a tray configured to collect condensate and a lid configured to both prevent the mixing of air and collect condensate, operatively connected by a plurality of standoffs attached to the base of the tray and the bottom of the lid wherein the lid is supported by the tray and the plurality of standoffs. The system further may include one or more condensate drain channels configured to collect and drain condensate from the top of the lid into the tray and subsequently drain from the tray through an exit port.

Abstract: A water collection system is provided for an indirect evaporative cooler. The water collection system includes a housing having an open bottom, a front wall, a back wall, and two end walls, which together define an interior region of the housing. The water collection system further includes a plurality of tube assemblies each extending through one of the front wall and the back wall of the housing and disposed within the interior region of the housing. The water collection system further includes a plurality of panel assemblies disposed within the interior region of the housing above the plurality of tube assemblies. Each panel assembly is associated with a respective tube assembly to channel fluid to the tube assembly. A method of collecting and distributing water within an indirect evaporative cooler configured to spray water on a heat exchanger is further disclosed.

Abstract: A method for constructing a module of a modular cooling unit includes acquiring a plurality of tubes, each tube having a first end and a second end, and overmolding a first header onto the first ends of the plurality of tubes to form a watertight connection between the first header and the first ends of the plurality of tubes, the first header having a plurality of parallel first slots, each slot of the parallel first slots having an extended surface configured to receive and retain the first end of the tube.