Patents by Inventor Roy Lee

Roy Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9676903
    Abstract: A polyester resin copolymerized with isosorbide and 1,4-cyclohexane dimethanol and having an improved impact strength, and a method for preparing the same are disclosed. The copolymerized polyester resin has an alternating structure of acid moieties which are derived from acid components and diol moieties which are derived from diol components, wherein the acid components comprise terephthalic acid, and the diol components comprise (i) 5˜99 mol % of 1,4-cyclohexanedimethanol and (ii) 1˜60 mol % of isosorbide with respect to the total diol components.
    Type: Grant
    Filed: April 14, 2016
    Date of Patent: June 13, 2017
    Assignee: SK CHEMICALS CO., LTD.
    Inventors: Roy Lee, Jong-Ryang Kim, Jae-Bong Lim, Won-Jae Yoon, Dong-Jin Kim, Kyu-Tae Park, Yoo-Jin Lee
  • Publication number: 20160222157
    Abstract: A polyester resin copolymerized with isosorbide and 1,4-cyclohexane dimethanol and having an improved impact strength, and a method for preparing the same are disclosed. The copolymerized polyester resin has an alternating structure of acid moieties which are derived from acid components and diol moieties which are derived from diol components, wherein the acid components comprise terephthalic acid, and the diol components comprise (i) 5˜99 mol % of 1,4-cyclohexanedimethanol and (ii) 1˜60 mol % of isosorbide with respect to the total diol components.
    Type: Application
    Filed: April 14, 2016
    Publication date: August 4, 2016
    Inventors: Roy Lee, Jong-Ryang Kim, Jae-Bong Lim, Won-Jae Yoon, Dong-Jin Kim, Kyu-Tae Park, Yoo-Jin Lee
  • Patent number: 9169365
    Abstract: A copolymerized polyester heat shrinkable film which can be used as a label, a cap seal or a direct packaging for various containers is disclosed. The copolymerized polyester heat shrinkable film is made of a copolymerized polyester resin having alternating structures of acid moieties which are derived from acid components and diol moieties which are derived from diol components, the acid components comprising terephthalic acid, and the diol components comprising isosorbide 1,4-cyclohexanedimethanol and ethylene glycol. The copolymerized polyester heat shrinkable film has a shrinkage initiation temperature of equal to or more than 60° C., and a maximum heat shrinkage ratio of less than 2% at 60 to 70° C., and a maximum heat shrinkage ratio of 50 to 90% at 90 to 100° C.
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: October 27, 2015
    Assignee: SK CHEMICALS CO., LTD.
    Inventors: Roy Lee, Jong-Ryang Kim, Won-Jae Yoon
  • Patent number: 8633295
    Abstract: A blend of polylactic acid resin and copolyester resin and a molded article using the same having superior impact resistance and heat resistance are disclosed. The blend of polylactic acid resin and copolyester resin includes: 5 to 95 weight % of polylactic acid resin; and 5 to 95 weight % of copolyester resin which is a copolymerization product of an acid component including terephthalic acid and a diol component including 5 to 99 mol % of 1,4-cyclohexanedimethanol and 1 to 60 mol % of isosorbide(bio monomer), and has a repeated structure of an acid moiety derived from the acid component and a diol moiety derived from the diol component.
    Type: Grant
    Filed: May 19, 2011
    Date of Patent: January 21, 2014
    Assignee: SK Chemicals Co., Ltd.
    Inventors: Roy Lee, Jong-Ryang Kim, Kye-Yune Lee, Jong-Wook Shin, Young-Man Yoo
  • Publication number: 20130072642
    Abstract: A blend of polylactic acid resin and copolyester resin and a molded article using the same having superior impact resistance and heat resistance are disclosed. The blend of polylactic acid resin and copolyester resin includes: 5 to 95 weight % of polylactic acid resin; and 5 to 95 weight % of copolyester resin which is a copolymerization product of an acid component including terephthalic acid and a diol component including 5 to 99 mol % of 1,4-cyclohexanedimethanol and 1 to 60 mol % of isosorbide(bio monomer), and has a repeated structure of an acid moiety derived from the acid component and a diol moiety derived from the diol component.
    Type: Application
    Filed: May 19, 2011
    Publication date: March 21, 2013
    Applicant: SK CHEMICALS CO., LTD.
    Inventors: Roy Lee, Jong-Ryang Kim, Kye-Yune Lee, Jong-Wook Shin, Young-Man Yoo
  • Publication number: 20120226014
    Abstract: A copolymerized polyester heat shrinkable film which can be used as a label, a cap seal or a direct packaging for various containers is disclosed. The copolymerized polyester heat shrinkable film is made of a copolymerized polyester resin having alternating structures of acid moieties which are derived from acid components and diol moieties which are derived from diol components, the acid components comprising terephthalic acid, and the diol components comprising isosorbide represented by Formula 1 and ethylene glycol. The copolymerized polyester heat shrinkable film has a shrinkage initiation temperature of equal to or more than 60° C., and a maximum heat shrinkage ratio of less than 2% at 60 to 70° C., and a maximum heat shrinkage ratio of 50 to 90% at 90 to 100° C.
    Type: Application
    Filed: November 12, 2010
    Publication date: September 6, 2012
    Inventors: Roy Lee, Jong-Ryang Kim, Won-Jae Yoon
  • Publication number: 20120177854
    Abstract: A polyester resin copolymerized with isosorbide and 1,4-cyclohexane dimethanol and having an improved impact strength, and a method for preparing the same are disclosed. The copolymerized polyester resin has an alternating structure of acid moieties which are derived from acid components and diol moieties which are derived from diol components, wherein the acid components comprise terephthalic acid, and the diol components comprise (i) 5˜99 mol % of 1,4-cyclohexanedimethanol and (ii) 1˜60 mol % of isosorbide with respect to the total diol components.
    Type: Application
    Filed: September 13, 2010
    Publication date: July 12, 2012
    Inventors: Roy Lee, Jong-Ryang Kim, Jae-Bong Lim, Won-Jae Yoon, Dong-Jin Kim, Jyu-Tae Park, Yoo-Jin Lee
  • Patent number: 5201854
    Abstract: An apparatus for effecting electrical connection between the main machine and a module containing the apparatus for advancing a sheet through the transfer zone and to registration for information developed on the photoreceptor belt. The connector on the main machine is mounted to permit engagement with a complementary connector on the module, but provide for movement when the module is raised slightly to contact the photoreceptor module. The apparatus minimizes which otherwise would inhibit this upward movement and detract from proper operation of the machine and the quality of the copy produced.
    Type: Grant
    Filed: September 6, 1991
    Date of Patent: April 13, 1993
    Assignee: Xerox Corporation
    Inventors: David K. Ahl, Roger M. Swanson, Timothy G. Struczewski, James C. Fox, Roy Lee, Michael Terietzki, Gary R. Skillman, Ross E. Schroll
  • Patent number: 5164813
    Abstract: A new diode structure is provided by bonding two semiconductor materials together having a low capacitance, a large contact area and mechanical ruggedness. The cross-sectional area of at least one of the semiconductor materials is reduced in the region of the bond resulting in a structure with either an hourglass or truncated hourglass-like cross-section. A diode PN junction is contained in the neighborhood of the area of reduced cross section. The diode so constructed provides a sufficient spacing between the unbonded semiconductor regions to reduce total packaged diode capacitance without introducing a spacer layer. The diode is processed to limit the area of the PN junction formed therein to the region of the bonding between the semiconductor materials, without limiting the metallized contact area, further controlling the diode capacitance as well as other electrical characteristics.
    Type: Grant
    Filed: May 8, 1991
    Date of Patent: November 17, 1992
    Assignee: Unitrode Corporation
    Inventors: Scott C. Blackstone, Philip L. Hower, Elizabeth M. Roughan, Christopher H. Doucette, Roy Lee, Carolyn Q. Cotnam