Abstract: The present invention pertains to a shoe upper, the method for preparing the same and the use thereof. This invention provides a method for preparing shoe upper by spraying polyurethane reaction system, avoids the complicated steps of cutting, shaping, stitching and bonding, simplify the production process, reduces the equipment requirements, saves cost and improves the production efficiency.

Abstract: A memory card structure includes a substrate, B-Stage glue, an adhered layer, a chip, wires, and a compound layer. The substrate has an upper surface, which is formed with first electrodes and golden fingers electrically connected to the first electrodes. The B-Stage glue is coated on the periphery of upper surface of the substrate. The adhered layer is coated on the upper surface of the substrate. The chip is formed with bonding pads, and is adhered on the upper surface of the substrate by the B-Stage glue and the adhered layer. The plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate. And the compound layer is encapsulated on the chip and the wires.

Abstract: A module card structure includes a structure, a first chip, a second chip, an adhesive layer, and a compound layer. The substrate has an upper surface on which a plurality of golden fingers are formed, and a lower surface. The first chip is mounted on the upper surface of the substrate and is electrically connected to the golden fingers by first wires. The second chip is adhered to the upper surface of the substrate by the adhesive layer, which includes glue and filling elements, and is electrically connected to the golden fingers by second wires. The compound layer is encapsulated on the first chip and the second chip.

Abstract: A module card structure includes a structure, a first chip, a second chip, an adhered layer, and a compound layer. The substrate has an upper surface on which a plurality of golden finger are formed, and a lower surface. The first chip is mounted on the upper surface of the substrate and is electrically connected to the golden finger by wires. The second chip is adhered to the upper surface of the substrate by adhered layer, which includes glue and filled elements, and is electrically connected to the golden finger by wires. The compound layer is encapsulated on the first chip and second chip for encapsulating the first chip and second chip.