Patents by Inventor Roy Lynn

Roy Lynn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8476543
    Abstract: An electromechanical switch includes a contact assembly and a linkage assembly.
    Type: Grant
    Filed: May 6, 2011
    Date of Patent: July 2, 2013
    Assignee: Staco Systems, Inc.
    Inventors: Roy Lynn Hart, Kevin Mikio Takeuchi
  • Publication number: 20110290623
    Abstract: An electromechanical switch includes a contact assembly and a linkage assembly.
    Type: Application
    Filed: May 6, 2011
    Publication date: December 1, 2011
    Inventors: Roy Lynn Hart, Kevin Mikio Takeuchi
  • Publication number: 20100027400
    Abstract: Disclosed herein are embodiments of motion limiting cover features that improve coil/VCM coupled resonance. The features are flexible in that their position and configuration can be customized to specifically target a certain type of undesirable motion, such as undesirable twisting (i.e., torsion) and/or bending.
    Type: Application
    Filed: January 16, 2009
    Publication date: February 4, 2010
    Applicant: Seagate Technology LLC
    Inventors: Hong Zhu, Roy Lynn Wood, James Roger Mahoney, Gene Allyn Thompson, Peng Yan
  • Patent number: 7274530
    Abstract: In a data handling system having a radially-dependent track incongruity between data surfaces, at least some tracks are logically mapped so that tracks on different data surfaces correspond with one another. The correspondence is defined by the mapping so as to shorten an average headswitch seek. For example, a logical track mapping of first and second non-coaxial track sets can be defined so as to optimize a headswitch seek within each of many intermediate logical cylinders identified in the mapping.
    Type: Grant
    Filed: October 9, 2003
    Date of Patent: September 25, 2007
    Assignee: Seagate Technology LLC
    Inventors: Nathaniel Boyd Wilson, Roy Lynn Wood
  • Patent number: 6643080
    Abstract: Method and apparatus for identifying a resonance by changing a spindle speed, which has the effect of changing a corresponding sampling rate and Nyquist frequency. The invention discriminates (1) between plausible frequencies of true resonance and/or (2) aliased resonance from non-aliased resonances. This is accomplished by monitoring whether and/or how a resonance shifts during this speed change. Methods of the present invention monitor resonances by deriving a resonance indicator such as an apparent frequency (below the Nyquist frequency), a gain or error magnitude (compared to a derived threshold at a calculated frequency of interest), or similar criteria tested by values conventionally illustrated on a Bode plot. The present invention further includes steps or structural features for configuring a controller to attenuate or similarly limit an unwanted frequency component of an actuator control signal. In this way, resonances in the actuator can be reduced, and servo speed and accuracy thereby enhanced.
    Type: Grant
    Filed: July 27, 2000
    Date of Patent: November 4, 2003
    Assignee: Seagate Technology LLC
    Inventors: Clyde Everett Goodner, III, Roy Lynn Wood, Lealon Ray McKenzie
  • Patent number: 6497786
    Abstract: Systems, methods and apparatus are disclosed for bonding a plurality of substrates via a solventless, curable adhesive. At least one of the substrates has a deformation temperature below the activation temperature of the adhesive. A workpiece is assembled from a plurality of substrates with the curable adhesive disposed therebetween. Pressure is applied to the workpiece and the workpiece is irradiated with variable frequency microwave energy. The workpiece is swept with at least one window of microwave frequencies selected to heat the adhesive without heating the substrates above their respective deformation temperatures.
    Type: Grant
    Filed: November 6, 1997
    Date of Patent: December 24, 2002
    Assignee: Nike, Inc.
    Inventors: Bruce J. Kilgore, Thomas McKnight, Roy Lynn O'Mohunddro, John A. Battista, Jr., Richard J. Petrucci, Zakaryae Fathi, Jianghua Wei
  • Patent number: 6477000
    Abstract: An apparatus and method for minimizing damage to a disc drive assembly subjected to non-operational shock. The disc drive has rotatable discs upon which data can be written and read by read/write heads supported by and controllable by an actuator assembly having actuator arms moveable over the complete data containing surfaces of the discs. A disc snubber is supported in apertures in the actuator arms, the disc snubber having bumper arms radially extending to nest the outer perimeters of the discs when the disc drive assembly is in its non-operational mode. The disc snubber is in clearing relationship to the discs in the operational mode. The disc snubber is disposed to dampen disc deflection caused by non-operational shock, thereby avoiding deleterious actuator arm/disc contact.
    Type: Grant
    Filed: December 31, 1997
    Date of Patent: November 5, 2002
    Assignee: Seagate Technology LLC
    Inventors: Kenneth Lee Pottebaum, Roy Lynn Wood
  • Patent number: 6377420
    Abstract: A disc drive having reduced mechanical vibration is disclosed. An annular viscoelastic damper is sandwiched beneath the head disc assembly cover against the bearing assembly of the actuator to dampen mechanical vibrations transmitted by the cover to the actuator assembly. The damper is an annular disc made of a composite of a layer of viscoelastic polymer and a backing stiffening layer.
    Type: Grant
    Filed: September 20, 2000
    Date of Patent: April 23, 2002
    Assignee: Seagate Technology LLC
    Inventors: Srinivas Tadepalli, Roy Lynn Wood
  • Publication number: 20020034041
    Abstract: A data disc support assembly comprising a hub with a first axial end and a second axial end and a flange depending from the second axial end, the flange comprising a contact surface extending radially from the central axis between an inner contact surface radius and an outer contact surface radius and imparting a clamping force toward one surface of the disc. A clamp connected to the hub comprises a contact surface imparting a clamping force toward an opposing surface of the disc, the clamp contact surface extending radially from the central axis between in inner contact surface radius and an outer contact surface radius, wherein the flange contact surface and the clamp contact surface are substantially equivalent and radially offset.
    Type: Application
    Filed: June 29, 2001
    Publication date: March 21, 2002
    Inventors: Erming Luo, Roy Lynn, John Daniel Stricklin
  • Patent number: 6194024
    Abstract: The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: February 27, 2001
    Assignee: International Business Machines Corporation
    Inventors: Roy Lynn Arldt, Christina Marie Boyko, Burtran Joe Cayson, Richard Michael Kozlowski, Joseph Duane Kulesza, John Matthew Lauffer, Philip Chihchau Liu, Voya Rista Markovich, Issa Said Mahmoud, James Francis Muska, Kostas Papathomas, Joseph Gene Sabia, Richard Anthony Schumacher
  • Patent number: 6134772
    Abstract: The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.
    Type: Grant
    Filed: December 18, 1998
    Date of Patent: October 24, 2000
    Assignee: International Business Machines Corporation
    Inventors: Roy Lynn Arldt, Christina Marie Boyko, Burtran Joe Cayson, Richard Michael Kozlowski, Joseph Duane Kulesza, John Matthew Lauffer, Philip Chihchau Liu, Voya Rista Markovich, Issa Said Mahmoud, James Francis Muska, Kostas Papathomas, Joseph Gene Sabia, Richard Anthony Schumacher
  • Patent number: 5999371
    Abstract: An actuator latch for latching an actuator of a disc drive having a rotating disc that induces airflow when the disc drive is operational, the actuator latch having a shaft supported by a baseplate, the shaft supporting a plurality of vanes to rotate the shaft in response to airflow generated by disc rotation. A locking member is operably engaged with the shaft and moveable thereby to a latched position and to an unlatched position, the actuator being secured by the locking member in the latched position and the actuator being released to move freely in the unlatched position. The locking member is caused to be positioned in the unlatched position when airflow rotates the vanes and shaft, and a biasing member reverse rotates the shaft when the airflow ceases, thus returning the locking member to the latched position when the disc drive becomes non-operational.
    Type: Grant
    Filed: January 30, 1998
    Date of Patent: December 7, 1999
    Assignee: Seagate Technology, Inc.
    Inventors: Roy Lynn Wood, Ryan Todd Ratliff, Nigel Frank Misso
  • Patent number: 5907453
    Abstract: Apparatus and method for enhancing the convective cooling of a voice coil motor (VCM) of a disc drive. A portion of an air flow established by the rotation of a disc of the disc drive is diverted from the disc and is directed through a channel to the VCM. In one embodiment, an air foil is provided to support first and second magnetic paths of the VCM, the air foil having a shroud surface adjacent portions of the circumference of the disc and a diverter surface angularly extending from the shroud surface, the diverter surface diverting the air to the VCM. Alternatively, a base deck of the disc drive is provided with a shroud circumferentially adjacent portions of the disc and the channel extends through the shroud to direct the air from the disc to the VCM.
    Type: Grant
    Filed: July 8, 1997
    Date of Patent: May 25, 1999
    Assignee: Seagate Technology, Inc.
    Inventors: Roy Lynn Wood, Phillip R. Ridenour, Steven S. Eckerd, Carl Fred Adams
  • Patent number: 5859358
    Abstract: Apparatus and method for measuring the maximum static friction force and the kinetic friction force between the heads of a disc drive and discs adjacent the heads. The disc drive is rotated by a computer controlled spin-up motor which provides constant angular acceleration of the disc drive. Voltages at the ends of the windings of a spindle motor of the disc drive are sampled to detect the angular acceleration at which disc rotation relative to the heads begins, from which the static friction force and the kinetic friction force are determined. The angular acceleration of the disc drive is monitored through the sampling of velocity commands used to control the angular acceleration of the disc drive, or through the use of an accelerometer mounted with respect to the disc drive.
    Type: Grant
    Filed: April 30, 1997
    Date of Patent: January 12, 1999
    Assignee: Seagate Technology, Inc.
    Inventors: Roy Lynn Wood, Steven S. Eckerd
  • Patent number: 5766670
    Abstract: The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.
    Type: Grant
    Filed: November 17, 1993
    Date of Patent: June 16, 1998
    Inventors: Roy Lynn Arldt, Christina Marie Boyko, Burtran Joe Cayson, Richard Michael Kozlowski, Joseph Duane Kulesza, John Matthew Lauffer, Philip Chihchau Liu, Voya Rista Markovich, Issa Said Mahmoud, James Francis Muska, Kostas Papathomas, Joseph Gene Sabia, Richard Anthony Schumacher