Abstract: An apparatus for placement of electronic components on a fluxed hybrid circuit substrate. In accordance with an automated program, the apparatus at a single work station places with high precision a plurality of chips of various types and physical and electrical sizes on a single substrate. Components are successively placed by a pair of hollow pick and placement spindles operating alternately and having motion in the X-Y planes. Precise location of stored chips is not required; the apparatus orients and centers each chip after selection and prior to placement.

Abstract: An apparatus for receiving a plurality of electrical components having a body portion and coaxial leads extending in opposite directions therefrom and securing said components in lengths of heat sealed tape on their extremities.

Abstract: An apparatus for sequentially feeding axial lead electrical components to a first plane, severing surplus lead material, bending one lead so that said component and said other lead are perpendicular to the first plane, preforming the end of the other lead into an L-shape, bending the remaining section of the one lead to be perpendicular to the first plane and inserting the leads into holes in a circuit board.