Abstract: An apparatus comprises a plurality of logically independent processors, a system bus, and a cache control and bus bridge device in communication with the plurality of processors such that the cache control and bus bridge device is logically interposed between the processors and the system bus, and wherein the processors and cache control and bus bridge device are disposed in a module form factor such that the apparatus is a drop-in replacement for a standard single processor module.

Abstract: A heat sink is constructed including at least one heat sink fin. Each fin includes an opening sized to fit a thermal device when the fins are heated to a temperature above that of the thermal device. When the fins cool to the temperature of the thermal device they shrink in size and form a tight compression fit around the thermal device.

Abstract: A sealed pouch constructed of thermally conductive flexible material containing a low melting point, thermally conductive material is placed between two components that require thermal continuity. This assembly is then loaded in compression and heated to the melting point of the low melting point, thermally conductive material, which then melts within the sealed pouch, and conforms to the shape of the two components. The sealed pouch also may contain a springy material made of a metal, or a solder compatible plastic or organic to help maintain shape of the pouch in some applications.

Abstract: A cooling assembly is disclosed comprising one or more heat pipes heat pipes connected to a base member, a plurality of thermal plates connected to the one or more heat pipes at predefined intervals, wherein the one or more heat pipes intersects the plurality of thermal plates, and an opening fashioned in each one of the plurality of thermal plates.

Abstract: A cooling apparatus for stacked components. Heat generating components may be mounted on two sides of a first printed circuit board. A second circuit board may be stacked over the first circuit board with a thermally conductive frame disposed between the two boards. The frame includes a cross member thermally coupled to the heat generating component on the top side of the first circuit board. The heat generating component on the bottom side of the first circuit board is thermally coupled to one leg of a thermally-conductive strap. The strap has a second leg that is thermally coupled to one end of the thermally conductive frame and also to one end of a heat distribution member mounted adjacent the second circuit board. The apparatus functions to channel heat from the first board's top and bottom components to the heat distribution member via the thermally-conductive frame and the thermally-conductive strap.

Abstract: An apparatus comprises a plurality of logically independent processors, a system bus, and a cache control and bus bridge device in communication with the plurality of processors such that the cache control and bus bridge device is logically interposed between the processors and the system bus, and wherein the processors and cache control and bus bridge device are disposed in a module form factor such that the apparatus is a drop-in replacement for a standard single processor module.

Abstract: A sealed pouch constructed of thermally conductive flexible material containing a low melting point, thermally conductive material is placed between two components that require thermal continuity. This assembly is then loaded in compression and heated to the melting point of the low melting point, thermally conductive material, which then melts within the sealed pouch, and conforms to the shape of the two components. The sealed pouch also may contain a springy material made of a metal, or a solder compatible plastic or organic to help maintain shape of the pouch in some applications.

Abstract: A cooling apparatus for stacked components. Heat generating components may be mounted on two sides of a first printed circuit board. A second circuit board may be stacked over the first circuit board with a thermally conductive frame disposed between the two boards. The frame includes a cross member thermally coupled to the heat generating component on the top side of the first circuit board. The heat generating component on the bottom side of the first circuit board is thermally coupled to one leg of a thermally-conductive strap. The strap has a second leg that is thermally coupled to one end of the thermally conductive frame and also to one end of a heat distribution member mounted adjacent the second circuit board. The apparatus functions to channel heat from the first board's top and bottom components to the heat distribution member via the thermally-conductive frame and the thermally-conductive strap.

Abstract: A heat sink is constructed including at least one heat sink fin. Each fin includes an opening sized to fit a thermal device when the fins are heated to a temperature above that of the thermal device. When the fins cool to the temperature of the thermal device they shrink in size and form a tight compression fit around the thermal device.

Abstract: A sealed pouch constructed of thermally conductive flexible material containing a low melting point, thermally conductive material is placed between two components that require thermal continuity. This assembly is then loaded in compression and heated to the melting point of the low melting point, thermally conductive material, which then melts within the sealed pouch, and conforms to the shape of the two components. The sealed pouch also may contain a springy material made of a metal, or a solder compatible plastic or organic to help maintain shape of the pouch in some applications.

Abstract: A heat-activated self-aligning heat sink is built thermally connecting at least one heat-generating devices on a substrate to the heat sink body, where the heat-generating devices may not be co-planar with each other due to tolerance stack-up or parallel with the heat sink body. A pedestal is attached to the substrate to support the heat sink body. A plug or floating pedestal is placed on top of each heat-generating device and held within the pedestal allowing sufficient movement for the bottom surface of the plug to fully contact the top surface of the heat-generating device. A quantity of a low melting temperature, thermally conductive material, such as solder, or a thermally conductive liquid, is placed over each plug and a heat sink body is placed over the assembly. When heated, the thermal material melts, forming a low impedance thermal junction between the plug and the heat sink body regardless of planarity differences between the two devices.

Abstract: A system and method are disclosed which include at least one blade implemented within an air moving device to enable enhanced performance of such air moving device. In one embodiment, an air moving device is disclosed that is operable to generate a flow of air from a low pressure region to a high pressure region. The air moving device comprises at least one blade that is operable to generate a flow of air as a result of movement thereof. The blade(s) include a rough surface on a side facing the low pressure region, and such rough surface is arranged to induce a turbulent boundary layer that enables operation of the air moving device in a manner that would otherwise result in separation of air from the blade(s). The rough surface may be formed by dimples or bumps, as examples, arranged on the surface of the blade(s).

Abstract: A system and method are disclosed which include at least one blade implemented within an air moving device to enable enhanced performance of such air moving device. In one embodiment, an air moving device is disclosed that is operable to generate a flow of air from a low pressure region to a high pressure region. The air moving device comprises at least one blade that is operable to generate a flow of air as a result of movement thereof. The blade(s) include a rough surface on a side facing the low pressure region, and such rough surface is arranged to induce a turbulent boundary layer that enables operation of the air moving device in a manner that would otherwise result in separation of air from the blade(s). The rough surface may be formed by dimples or bumps, as examples, arranged on the surface of the blade(s).

Abstract: The air moving assembly includes at least one air moving device and a stator, said stator being operable to at least reduce one expansion and/or one contraction for airflow passing through the assembly. The stator is also preferably operable to impart or adjust swirl for airflow passing through the stator. In at least one embodiment, the imparted or adjusted swirl rotates in a direction opposite to that of the rotation of an impeller of the air moving device. As a result, in at least one embodiment, airflow exiting the air assembly has no rotational component. The air moving assembly may include additional air moving devices and/or stators. In at least one embodiment, the air moving assembly includes first and second air moving assemblies coupled to a shared strut assembly.

Abstract: The air moving assembly includes at least one air moving device and a stator, said stator being operable to at least reduce one expansion and/or one contraction for airflow passing through the assembly. The stator is also preferably operable to impart or adjust swirl for airflow passing through the stator. In at least one embodiment, the imparted or adjusted swirl rotates in a direction opposite to that of the rotation of an impeller of the air moving device. As a result, in at least one embodiment, airflow exiting the air assembly has no rotational component. The air moving assembly may include additional air moving devices and/or stators. In at least one embodiment, the air moving assembly includes first and second air moving assemblies coupled to a shared strut assembly.